Ausgabe 02/2004

Latest News / Exhibitions

Design

Chinese government and Cadence introduce a new high-quality qualification in electronics designer training 
(H. Poschmann) 

CAD service providers in FED (Part 2) 

System Design Using Printed Circuit Board Design Methods 
(K. Pontius, F. Krämer) 

Toshiba offers lead-free semiconductor-assembly modules way ahead of the WEEE deadline 

Printed Circuit Board Technologies

Laser-enhanced micro-machining for printed circuit board prototype manufacture 

Ruwel AG: Pfullingen is a key link to customers 

Preventing whisker formation 
(Ch. Xu, Ch. Fan, Y. Zhang, J. A. Abys) 

Umicore Galvanotechnik takes over European representation of Uyemura 

Improving the process and avoiding registration defects New version 4.0 of PerfecTest 

Packaging / Hybrid Technology

Using the right technique for better yields: Wire-bonding with 3D-stacked die packages 

The multifunctional Condor bond testers from XYZTEC are top-flight revolutionary products 

MID and film – innovative product configuration and processes 

Board Assembly Technologies

Meeting the lead-free challenge: Standards offer opportunities 
(W. Huck, M. Teigeler, K. Metz) 

Reliable automated detection of BGA defects 

A new SMD mask manufacturer: Christian Koenen GmbH - Lasertechnik 

DVS Colloquium on lead-free soldering 

Innovative technologies and processes. Part 1. 
(A. Abach, M. Boiger, C. Seidel) 

ONYX 29 – new semi-automatic selective soldering system with fascinating properties 

abp is 10 years old 

Product News 

Profiling the Reasons Why? 
(B. Willis) 

Forum

Workshop on 6th EU Framework programme focused on Priority 3 
(E. Effenberger) 

Price is the key in competing for the European market for low-voltage switches and fuses 

Association News
(All Association News are only in German)

3-D MID-Informationen

DVS-Mitteilungen

FED-Informationen

VdL-Nachrichten

ZVEI-Mitteilungen

IMAPS-Mitteilungen