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Ausgabe 07/2002
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Design
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Synatron: new software for reliability of interconnections
Optical Backplanes for High Speed Signals
(M. Schock)
Ansoft launches its latest simulation software Maxwell 9.0
Mentor Graphics now offers an improved library and new data management system
Guidelines for Locating Components in Libraries
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Printed Circuit Board Technologies
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New VOC Guidelines and their impact on the printed circuit board industry
Latest Developments in Electrical Testing of HDI Substrates
(H. Yamazaki, G. Tint, St. Juchem)
Gramm Precious Metal Technologies – a Partner for the Electronics Industry
Surface Finishing A revival of pumice scrubbing
VOGT/FUBA steps up its activities in Tunisia
MIE – Multiline International Europa L.P. using SDI to enlarge the product range
Adara-Technik: Once an Outsider, now on the way to becoming a de-facto standard
Second customer workshop in Gerlingen
PLUS Internet Topics
Rapid prototyping of printed circuit boards. Part 4
The Vario thick-copper technology from the rotra-Group:
Increased performance using a cost-optimised process sequence
Product News
esi: Cutting Edge Laser Technologies Assure a Bright Future
Alcatel adopts the Atotech direct metallising process for mass production of HDI circuits to win both economic and environmental benefits
Information on the state of production at the click of a mouse
Printed circuit board industry reports decreased turnover
DimAnT improves dimensional stabilities in the production process
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Packaging / Hybrid Technology
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Product News
Copper-plated ceramic substrate
(H. Heusner)
The Institute for Mechatronics at Heilbronn is set up
HILPERT electronics GmbH: a Partner in Process Optimisation
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Board Assembly Technologies
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Schlafhorst Electronics celebrates its 5th year of independence
gktec marks its 10th year, offering technical consultancy to the Electronics Industry
1st Nord-Rhein Westfalian Technology Meeting is warmly received
An industry colloquium in Nuremberg sets out the Bavarian Mechatronics Initiative
Selective Thermal Curing – a New Production Method for Chip-Size Packages and HDI Printed Circuit Boards
(G. Wiltsche)
Satisfied participants after the Boundary Scan Days at GÖPEL electronics
Technology Forum for Vapour Phase Soldering Technology – Numerous Benefits arouse widespread interest
Product News
IPC and JEDEC step-up the pressure for lead-free in the USA
The first lead-free product is now available in the United States
Innovative strategies in Contract Electronic Manufacturing
4. ATE –Technology Meeting at the Lake of Constance - new ideas were received with much interest
High-Line Conformal Coating
Novel process technology for protective coatings on electronic assemblies
Applications of Modern Video Measurement Techniques in the Electronics Industry
The NEXIV VMR range from Nikon
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Forum
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Control 2002 reveals that Quality, now as always, is prime consideration
The Patent Department – Not a Cost Centre but a Profit Centre
(H.-W. Diesing)
The IPC establishes itself on a global scale – the first actual moves are made
Dietmar Harting re-elected as ZVEI President
A new electronic golf glove – using electronics to improve one’s handicap
(E. Effenberger)
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Association News
(All Association News are only in German)
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