| |
Coverage and Scope
PLUS brings you technical coverage of everything - from initial design stages, through printed circuit board production, to complete electronics assemblies. Practically orientated information and reports on interesting events are complemented by detailed papers by specialists about latest findings and developments.
The concept underlying PLUS is to include the entire production sequence, but treating this on a sectionalised basis, to meet the needs of the busy specialist. Separate sections cover Design, Printed Circuit Boards and Assembly. Each of these includes reviews and updates of materials, processes and equipment, while across-the-board issues such as Quality, Testing and Environmental issues are also featured. Also featured monthly are updates on Industry news, the latest IPC and other Standards and Guidelines, as well as newly-launched technical products.
PLUS is also the official organ of
- FED Fachverband Elektronik-Design e.V.
- VdL Verband der Leiterplattenindustrie e.V. im ZVEI
- EITI European Interconnect Technology Initiative e.V.
- IMAPS Deutschland e.V. International Microelectronics and Packaging Society
- ZVEI Fachverband Electronic Components and Systems
- Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
- DVS Deutscher Verband für Schweißen und verwandte Verfahren e.V.
News and technical programs from all of the above bodies is published monthly.
Circulation
The circulation of PLUS is around 4000 copies. Audited circulation data are published in each issue.
Distribution
PLUS is distributed on paid subscription basis to over 34 countries around the world.
Publication
PLUS is published mid-month (12 issues p.a).
Subscription
Annual subscription is EUR 68,95 (Germany), and EUR 86,40 (rest of world).
|
|
|
