Many years after the changeover from leaded to lead-free soldering processes, these are now established and largely trouble-free. Nevertheless, there are still new challenges. The companies Balver Zinn Josef Jost, Balve, and Rösnick, Bedburg, with their experience in wave soldering, want to pool their expertise.
Due to their relatively frequent occurrence, missing or poor solder penetration, fluctuating solder quality, shadow formation in narrow designs or bridging and much more are challenges that Balver Zinn and Rösnick tackle on a daily basis and solve together with their customers.
Expertise in consumables for electronics production
In addition to solders in a wide variety of delivery forms and alloys, Balver Zinn also supplies fluxes for lead-free and leaded soldering processes. The wide range of fluxes is used not only in wave soldering systems but also in solder wires and solder pastes. The modern REGI series in particular, with its different VOC content, has been attracting attention since its market launch. As a pioneer of the lead-free conversion, the application engineers at Balver Zinn can look back on many years of experience. Expertise in micro-doped solders and fluxes, in particular the brand new high-runner flux REGI-RED, combined with in-depth knowledge of the processes, help to solve problems(Fig. 1 and Fig. 2).
Fig. 2: REGI-RED ORL0 :Wave soldering on OSP, surface temperature: 390°C, flux volume: 40ml/min
Competence for operating materials in electronics production
In addition to soldering frames, soldering systems, workpiece and product carriers, Rösnick also supplies milling adapters and painting frames. The company's expertise therefore covers many areas relating to fixture construction in the electronics industry. For example, soldering systems can be upgraded with automatic poka-yoke closing mechanisms, thus eliminating placement errors such as missing components or incorrectly polarized THT components. By implementing titanium inserts in the soldering systems, wall thicknesses from 0.3 mm can be realized(Fig. 3). Even complex PCB designs can be mastered with this technology. The improved temperature transfer into the assemblies when using titanium also improves the step-through and therefore the soldering result, especially for mass-intensive components and narrow solder joints. To avoid solder bridges, Rösnick uses solder catcher technology(Fig. 4). For solder joints that tend to form solder bridges, a metal sheet pre-tinned on the underside and tin-repellent coated on the top ensures a clean solder break and draws excess tin away from the nearby solder joints. Embedded and screwed solder catchers can be integrated in almost all areas of a mask design and thus help to significantly reduce the error rate. Closer cooperation between the two companies in their core areas will provide the electronics industry with an even better supply of high-quality consumables and operating materials, as synergies are created and competencies are strengthened. The joint expertise and many years of experience in the field of electronics production enable the two companies to respond to the specific requirements of customers, offer individual solutions and thus reduce rejects and rework.
Fig. 3: Titanium insert with 0.3 mm wall thickness
Fig. 4: Solder catcher
