The 24th European Electronics Technology College was once again held in Colonia de Sant Jordi, Mallorca, Spain. It showed how the electronics industry can meet the new challenges and future trends and how the pain points can be turned into game points.
Ulf Oestermann
The program covered topics ranging from the integration of new digital twin technologies and AI support in production to intelligent solutions for error prevention. Among other things, the mechanical loads on printed circuit boards and robust communication were discussed and insights into the challenges and opportunities of New Work in the electronics industry were offered. In addition to the specialist presentations, discussion rounds and networking offered plenty of opportunities to exchange ideas, innovations and best practices with the experts and other participants.
Ulf Oestermann, Fraunhofer IZM, Berlin, moderated the event. At the opening, he briefly addressed the general situation and the topics of the lecture program. He cited Lamborghini as a classic example of how pain points can be turned into game points: the fact that the clutch of the cars back then was bad was the impetus for the original tractor manufacturer Lamborghini to develop into a racing car manufacturer. Whether and how pain points become game points also depends largely on so-called soft factors such as the error culture in the company and the work-life balance.
Ulf Oestermann concluded the introduction by presenting the partner companies that organize the EE-Kolleg. These are the companies:
- ASMPT
- ASYS Automation Systems
- Balver Zinn Josef Jost
- Christian Koenen
- kolb Cleaning Technology
- Rehm Thermal Systems
- ZEVAC
Soldering systems for optimizing electronics production
Dominik AlfersDominikAlfers, Rösnick, presented intelligent devices for error prevention and explained how soldering systems can optimize electronics production. Rösnick develops solder frames for fixing PCBs and solder masks for all common wave and selective soldering machines. These can be equipped with precisely fitting hold-down and alignment systems for the PCB as well as for the pressure and alignment of components. The increasing packing density of PCBs requires ever more complex solder mask designs, which means that conventional composite materials are reaching their limits. Titanium is an advantageous alternative due to its extreme strength and at the same time very high release resistance and insensitivity to flux and solder. Titanium also improves the temperature coupling to the PCB. Titanium inserts with bars can help to prevent solder bridges, which often occur due to an unfavorable PCB layout. With titanium, wall thicknesses from 0.3 mm can be realized, which is necessary for solder mask bridges between SMD and THT solder joints with very small distances. Correct THT placement can be checked using an optional poka-yoke system, a PCB-specific cover with openings in the component areas. Missing and incorrectly positioned components can be easily identified with the CIMI extension (Component Insertion Mispositioning Indicator). Rösnick GmbH is on its way to becoming a green company and recycles its soldering equipment.
Analyses to prevent errors in the production process
Gunter Mößinger, HTV Conservation, provided information on "Bad electronics: How do I detect and avoid faults in the manufacturing process?" He explained the corresponding services offered by his company. For example, HTV can fully requalify remanufactured components, which is necessary for their use in critical applications. Components can be checked for counterfeits. Solderability can be tested using wetting scales. If necessary, re-tinning or reballing is possible. Delamination can be detected using ultrasound microscopy (SAM). Microscopes are used to test the electronics in accordance with the acceptance criteria set out in the IPC-A-610 standard. The printed circuit boards can be evaluated. Connectors and other plastic components can also be tested for outgassing. In addition, further analyses can be carried out using thermography, X-ray inspection, CT and other methods, of which Gunter Mößinger gave examples.
Solder pastes with finer powder and nitrogen in demand
Michael MatthesUtaPruß and Andreas Hänisch, Prettl electronics, spoke about 'Development trends, standard type 3-4, 5 only on request? Soldering with and without nitrogen'. Uta Pruß began by introducing the EMS company Prettl electronics and its range of services. In line with market developments, the company is increasingly producing electronics for smart applications. The associated further miniaturization of electronics brings with it challenges for production, for example for solder paste printing. Andreas Hänisch explained these. Instead of the solder pastes with type 3 and type 4 solder powders previously used as standard, type 5 and type 6 solder pastes are now required in order to realize the finer structures. Paste printing problems can also occur when these are used. One cause of errors is fluctuations in the solder resist mask layer thickness. These irregularities in the topography can be compensated for with appropriately designed printing stencils. The advantages of soldering under nitrogen were also explained.
Communication between the partners is crucial
Michael Matthes from Würth Elektronik provided information on mechanical loads caused by heavy components on and in PCBs as well as other pain points and types of pain points. However, there are tools and options that offer solutions here too. Depending on the requirements of the product, the PCB design and construction is carried out with coins, inlays etc., examples of which were shown. Würth Elektronik offers and supports the entire PCB process, from design, assembly and structuring through to the digital solder mask and embedding of components. The same applies to assembly and testing, both electrical testing in production and qualification tests. Communication between the partners is crucial for success. Intensive communication is the basis for winning a match through Game Points.
Being understood is important in communication
What we can learn from stand-up comedy: Heino Trusmann, a coach with many years of experience in this profession, demonstrated what robust communication is and how it works during his performance with the involvement of participants. Being yourself, i.e. being authentic, is the basis for good communication. And being understood correctly is the most important thing.
Material transport with robots pays off
Jonas Ruckstuhl, Record Group, Fehraltorf, Switzerland, reported on an analysis of material logistics in production: cost efficiency through automated warehouses and robotic solutions. The Record Group, which is part of the ASSA ABLOY Group, is a manufacturer of automatic door systems with locations worldwide. The processes surrounding the actual, already highly automated production process are becoming increasingly important, particularly in order to transfer products within the Group to Switzerland, which has already been successfully implemented. An analysis of the distances covered for material transportation between the warehouse and production and their frequency revealed that this requires 600 working hours per year. This makes the use of a robot worthwhile. This is because practically all transports can be completed immediately and nothing is left lying around for any length of time, meaning that working time can be better utilized in production. Jonas Ruckstuhl explained how this has been or is being implemented. Among other things, he discussed the robot's IT and routes as well as loading and unloading.
Heino Trusmann in action with participants
Thomas Mueckl
Jonas Ruckstuhl
Using digital twins to see how planned processes work at an early stage
A digital twin is a data set that describes an object as completely as possible. To describe a production plant, several digital twins are required for the products and production processes. Thomas Mueckl from Zollner Elektronik demonstrated the benefits of using digital twins in production using application examples ranging from components to systems. The digital twin supports DfX (design for manufacturing, design for test, design for assembly, etc.), for example, by detecting possible collisions during assembly and insufficient contacting options for testing during the design phase and before physical realization. Digital twins can be used to plan workstations, production lines and the provision of materials, as well as for factory layout and plant planning. Digital twins thus enable robust process automation (RPA). Based on this data landscape of digital twins, virtual videos can be generated so that augmented reality glasses can be used to walk through the planned plant and view the planned product realization with the planned machines. Mock-ups are no longer necessary.
Generative AI increases employee efficiency
Fabian Pelzl, Knowron, provided information about Generative AI and used examples from production and service to illustrate how it can support work. Due to the general shortage of skilled workers, the challenge of deriving the right solution from the vast amount of available data through structuring is growing in many applications. Knowron has developed an NLP-supported tool that supports mobile employees as a personal assistant in their daily tasks. Thanks to this AI tool, organizational and technical knowledge becomes ubiquitous, i.e. available everywhere, in any language and around the clock. The example of the service technician shows that AI support also includes the generation of service reports. AI-supported employees thus become more efficient than others.
Improved X-ray inspection and CT through AI
Thorsten Wiege, maxerial AG, spoke about 'Improved Quality Assurance for Electronics Manufacturing with X-Rays and AI'. He began by explaining how computed tomography (CT) works in general and what it can achieve. A CT scan with a very high resolution in the range of a few micrometers takes around 40 minutes. For the subsequent analysis, maxerial has developed the Falknis X-ray Inspect software. It works with rule- and AI-based methods to quickly and accurately detect defects in solder joints and voids in electronic parts. Using the example of high-resolution CT images of SMT reels containing connectors, the software's performance in image recognition, data evaluation and geometric interpretation was demonstrated. AI is used for noise suppression, among other things. AI is also used for BGA evaluation. Further development is moving towards one-click AI.
Thanks to new pastes, products for new applications can be realized
Mario KohlMarioKohl, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, presented examples of what functional printing is and can achieve. Among other things, he discussed newly developed pastes, printed sensors (strain gages, etc.), hybrid electronics and printed batteries. The pastes are applied using screen printing and must be thermally treated after application in order to achieve the desired final properties.
Just give New Work a try
In the 'closing keynote', Alia Smektala, MTM Ruhrzinn, addressed generational differences, the shortage of skilled workers and the dreaded home office, providing insights and suggestions on New Work. The so-called generation gap is mainly based on prejudices and should therefore be viewed critically. The fact is, however, that there is a shortage of skilled workers, as one in four jobs is already vacant today and by 2030 it is expected to be one in three. What is important to Generation Z and what is the biggest difference to previous generations can be expressed as follows: "Everything Everywhere All at Once". This also includes working remotely (home office) at least some of the time. A majority would even change employer for this. But New Work is much more than that and there is no standard for it. Alia Smektala therefore concluded by recommending asking: "Why not just give it a try?"
The EE-Kolleg ended with a short discussion. This and the networking discussions showed that new ideas and an intensive exchange of ideas are always in demand, especially when it comes to turning pain points into game points. The 25th European Electronics Technology College, which is planned to take place again in Colonia de Sant Jordi from April 2 to 6, 2025, will once again offer plenty of opportunities for information and exchange.
