Investing in the future: free memberships for young members and educational institutions
The FED sees itself not only as a platform for knowledge transfer and technology dialog, but also as an active shaper of the future of our industry. A central concern here is to get young people interested in our industry at an early stage and to accompany them on their way into professional practice. After all, securing young talent is not a sure-fire success - it requires targeted measures, strong networks and a committed community.
Gerhard Gröner (left) with young designers and teachers from the Robert Bosch School in Ulm at the FED conferenceWeare sending out a clear signalwitha recent change to our statutes and membership fees: as of this year, the FED is offering free membership to young members and non-profit educational institutions such as universities and schools. The aim is to give young people uncomplicated access to the FED and its network of experts. At the same time, educational institutions can bring their students and learners closer to real industrial requirements and benefit from the extensive expertise of our community.
With Niklas Dubhorn and Luka Puhalj, the first young members have already opted for this approach. Educational institutions such as the Technical University of Nuremberg and the Formula Student Team "Dynamics - OTH Regensburg e.V." have also joined the FED as associate members - a promising start.
With FED course leader Gerhard Gröner, the FED offers technicians a two-year additional course in PCB layout as part of their regular training at the Technical School in Aalen and the Robert Bosch School in Ulm. In cooperation with the teachers, practical exercises were developed using specially created samples. In addition to this, the FED provides insights into the complexity of electronic products, necessary communication channels in the development and design phase and technical guidelines in theoretical sections. The training concludes with a three-part additional examination, which is certified by the FED.
Not forgetting the PAUL Award, which the FED is presenting for the fourth time in 2025. The competition is aimed at young electronics enthusiasts between the ages of 15 and 25 - whether as an individual or in a team. We are looking for creative hardware projects that help in everyday life or make a contribution to society. The award makes young talents visible, strengthens their motivation and offers them the opportunity to take their first steps into the professional world of electronics.
Companies from the FED environment are invited to support the PAUL Award as sponsors. After all, only together can we succeed in getting the next generation excited about technology and showing them how diverse and meaningful a career in electronics can be. The FED invests specifically in young people because they will shape the future of the electronics industry. With new membership models, practical competitions and an open network, we want to generate enthusiasm, promote potential and build bridges between training, universities and industry.
FED 3D electronics working group visits the FAPS: Requirements for eCAD tools for 3D electronics
A flying visit to the laboratory: the new system with wire laying technology was marveled atThe highlightof the strategy meeting of the FED 3D Electronics Working Group was the visit to the FAPS research department, Chair of Manufacturing Automation and Production Systems at the University of Nuremberg. The event not only offered the opportunity to discuss key issues relating to the additive manufacturing of electronics, but also provided exclusive insights into the ultra-modern FAPS laboratories headed by Professor Dr. Jörg Franke.
Nils Thielen from FAPS guided the participants through some of the twelve laboratories that deal intensively with 3D electronics. While the chair traditionally deals with MID technology (formerly Moulded Interconnect Devices, now Mechatronic Integrated Devices), additive manufacturing methods such as 3D printing are becoming increasingly important. Particular attention was paid to the new machine from NANODIMENSION and a system from NEOTECH, which was recently equipped with innovative wire-laying technology. NEOTECH's best-known technology sample is the 3D electronics egg. The technology not only enables the printing of fine conductor tracks of 30 to 40 µm, but also integrates SMD placement functions - a significant step towards highly integrated 3D electronics.
Since summer 2024, the working group has been a member of the international platform JAMES, which is dedicated to printed electronics and has already reached over 15,000 followers. The five classes of additive manufacturing processes defined by our working group represent an important contribution to the standardization of this technology and have already aroused international interest.
The most important item on the agenda of the working group meeting was the further development of eCAD functions for additive manufacturing. Michael Schleicher initiated a discussion on a possible definition of whether conductive paths should run on surfaces or in grooves - a relevant topic particularly for classes 1 and 2 from the FED 3D classification for additive manufacturing. In a structured working session, the 3D eCAD requirements for classes 3 and 4 were specified and updated directly in the project paper by Michael Matthes.
The working group's white paper, which defines the five classes of additive manufacturing principles for electronics, is to be updated for the 2025 edition by Daniel Ernst. One focus is the definition of eCAD requirements for the 5 classes of the FED "Classification for Additive Manufacturing Processes". The new version will be presented at the FED Conference 2025.
"I thought it was another very fruitful meeting, which was enriched by the insight into the FAPS laboratories. This is simply not possible at the web meetings. The new contacts with the FAPS are also very valuable for our work," says Hanno Platz, head of the working group, summarizing the added value of the meeting.
FED regional groups: In Jena, Thomas Platz was elected to head the group alongside Wolfgang Kühn
Thomas Platz works in quality management at Funkwerk in KölledaThedual leadership of the FED regional group in Jena is complete again. The members unanimously elected Thomas Platz as the second regional group leader. This means that Wolfgang Kühn, who has confidently led the FED regional group in Thuringia and southern Saxony-Anhalt for 30 years, now has competent support.
Thomas Platz brings extensive expertise from quality management at Funkwerk Systems GmbH in Kölleda. Funkwerk develops and manufactures communication systems for LTE, GSM-R and analog radio networks as well as safety solutions for the railroad industry and public transport. Thomas Platz came into contact with the FED when he acquired his trainer certificates in IPC-A-610, IPC J-STD-001 and IPC-A-600. Since then, he has been a regular participant in FED events - and now the next step follows.
"Taking over the regional group management is an exciting challenge for me," says Thomas Platz. "I want to help strengthen collaboration within the group and promote the exchange of ideas and best practices. At the same time, volunteering offers me the opportunity to expand my network and take away valuable ideas for my day-to-day work."
Impulses and dates by e-mail: The FED newsletter
Twice a month, the FED office provides experts in electronics design and component manufacturing with information, meetings of the FED regional groups and valuable impulses directly for download, registration or information. The FED newsletter is free of charge and can be canceled at any time. To subscribe, simply enter your name and e-mail address at this link: www.fed.de/newsletter.
Calendar of events May to July 2025
| 5.-7.5. | High-Speed Assembly Design, (ZED IV), Berlin | 22.5. | FED talk The path to CO2-neutral PCB production, online | |||
| 6./7.5. | When electronics burn, Düsseldorf | 2.6.-4.7. | ZED Level I - Basic circuit board design course, Berlin | |||
| 6.-8.5. | ESD protection management intensive course - English, online | 2./3.6. | Quality in the design process (ZED Level IV), online | |||
| 7.5. | FED talk Designing for Compliance: PCB-Specifications and How to Avoid Over-Specification, online | 4./5.6. | Fundamentals of Component Manufacturing (ZED IV), online | |||
| 12.-15.5. | IPC-A-610 course for specialists, Berlin | 11./12.6. | Quality and reliability of printed circuit boards and assemblies, Berlin | |||
| 12.-16.5. | IPC-A-610 course for trainers, Berlin | 11.6. | UL approvals for printed circuit boards, online | |||
| 15.5. | Obsolescence management in electronics, Siegen | 16./17.6. | EMC-compliant assembly design (ZED IV), Berlin | |||
| 15.5. | Austrian Electronics Day, Brunn am Gebirge | 17./18.6. | Electronics cooling in PCB design and manufacturing (ZED IV), online | |||
| 19./20.5. | IPC-A-610 H CIS - Recertification, Berlin | 23.-27.6. | ZED Level III - Printed circuit board assembly design 2, Neustadt/Aisch | |||
| 19./20.5. | IPC-A-610 H CIT - Recertification, Berlin | 24./25.6. | High-power module design, online | |||
| 19.-23.5. | ZED Level II - Printed circuit board assembly design 1 | 8./9.7. | High Density Interconnect and Microvias, online | |||
| 21.5. 13. | PCB Designer Day, Seefeld | 14.-16.7. | IPC-A-610 course for specialists, Hanover | |||
| 21.5. | FED talk High frequenzy PCB's - challenges and opportunities, online | 14.-16.7. | IPC-A-600 course for trainers, Hanover |
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