iMaps Announcements 05/2024

Announcement Conference, Exhibition and Call for Abstracts for the IMAPS Fall Conference 2024 It's just spring and you're already thinking about fall?

Exactly, because the IMAPS Fall Conference is seen by all participants as an important platform for professional discussions between industry and academia as well as production and research. We are promoting the conference, interesting and valuable contributions and the time period, as many people's busy schedules already recommend blocking October 17 and 18, 2024.

Almost everyone who has already attended appreciates the proven mix of professional exchange, personal interaction, exhibition, lecture series and consolidation of networks in an appropriate and justifiable manner. Speaking of exhibitors: with an inexpensive tabletop, you have the opportunity to engage in intensive discussions with trade visitors during the breaks as well as to attend the presentations yourself. You are welcome to use this opportunity to present your results in a lecture. Please submit your abstract for evaluation by July 1 (approx. 200 words). Please use the following link for submission: https://www.conftool.net/imaps-herbstkonferenz-2024/index.php

IMAPS Nordic - Microelectronics Packaging Conference and Exhibition, NordPac 2024

IMAPS Nordic will host the Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finland from June 11-13, 2024. The event will bring together both academics and industry leaders to discuss the state of the art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, electronics assembly and manufacturing, optics, electronics in healthcare technology, materials, artificial intelligence (AI) and Internet of Things (IoT) in electronics.

IMAPS Nordic invites you to its 60th event, and you can be part of this milestone. The Scandinavian colleagues take turns hosting the event in the 4 countries. Most recently, a relevant group of German participants met in Gothenburg, Tonsberg, Lyngby or Oulu. Find out more at: https://nordic.imapseurope.org/nordpac/

Calendar of events

IMAPS Germany - Your association for packaging and packaging technology

IMAPS Germany, part of the International Microelectronics and Packaging Society (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)