iMaps Announcements 06/2023

Call for Abstracts / German IMAPS Conference in Munich / October 19-20, 2023

IMAPS Germany would like to invite you to the Annual Conference 2023 in Munich.

Every autumn, IMAPS Germany organizes an annual conference on current topics in packaging technology in all fields of application. IMAPS Germany would like to see the annual conference as an important platform for the necessary close-meshed technical discussion between industry and academia as well as production and research in order to secure, strengthen and further develop Germany as a business location.

We therefore cordially invite you to present your results on the above-mentioned topics in the field of microelectronic packaging at our conference in front of representatives from industry and science and to discuss them together (presentation time 15-20 min + discussion, set of slides for the participants). We would be happy to publish a short contribution to the individual presentations on our homepage (although this is not mandatory). Use the opportunity for a wide-ranging exchange and present results and the latest findings from research and industry. You will find typical key topics in the table on the next page.

Please submit your abstract for evaluation by July 1, 2023 (approx. 200 words). Please use the following link for submission:

https://www.conftool.net/imaps-herbstkonferenz-2023/index.php

A BEST PRESENTATION AWARD will be presented again!

Tab. 1: Topics and focus of the IMAPS conference

Design, modeling, simulation	Materials and processes
Electrical and electromagnetic design Thermal and thermomechanical design Design for production and testing HF design and 3D design	Substrate materials and surface layer systems Production of wiring carriers Connection technologies (flip chip, CoB, SMT, embedding, ...) Protection, potting and encapsulation processes and materials Nanomaterials
IMAPS Conference 2022 Example: "Transient electro-thermally coupled simulation ..." (Gregor Wiedemann, BTU Cottbus-Senftenberg)	IMAPS Conference 2022 Example: "Investigations on soldering ... on printed polymer substrates" (Lukas Auer, Landshut University of Applied Sciences)
System integration technologies	Quality and reliability
Wafer level packaging (CSP, SiP, ...) Substrate level packaging (system on board, embedding, ...) MEMS / sensor packaging Optoelectronic packaging 3D Packaging	Process monitoring / test strategies Test systems Thermomechanical reliability Reliability under combined stresses Lifetime monitoring and prediction
IMAPS Conference 2022 Example: "... reduction of bonding pressure and temperature in Al-TC wafer bonding" (Silvia Braun, Fraunh. ENAS Chemnitz)	IMAPS Conference 2022 Example: "Reliable integration of electric modules in textiles" (Lars Stagun - Winner "Best Presentation 2022", TU Berlin)

Si submount for UVC LED chips with implanted photo- and temperature diodes for optical power control

Announcement: CiS Workshop Packaging & Connection Technology

"Current developments in hybrid and wafer level assembly"
Where: Erfurt
When: Tuesday, 12.09.2023

Which technology meets the technical requirements and offers competitive manufacturing costs? Which new possibilities and combinations have proven themselves?

As part of the workshop, leading representatives from industry and research in microsystem and semiconductor technology will report on experiences and new developments in the field of packaging and interconnection technology. We look forward to a presentation by Prof. Knechtel from Schmalkalden University of Applied Sciences as well as a report from ESCATEC. The focus will be on the reliable, low-reaction, voltage-optimized assembly of thin silicon sensors and high-performance optical assemblies, the advantages of individual processes will be considered and the discussion will be stimulated. The event offers a space to get to know new possibilities and to network the players.

If you would like to find out more or register, please follow the link below:

https://www.cismst.de/workshops/avt-2023/

Calendar of events

IMAPS Germany - Your association for packaging and interconnection technology

IMAPS Germany, part of the International Microelectronics and Packaging Society (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the board members at www.imaps.de

(Board of Directors)