Once again, the PCIM Expo & Conference and 'Sensor + Test' trade fairs and the SMIS conference will be held in parallel at the Nuremberg Exhibition Center. The attractive combination of trade fairs promises to attract numerous visitors: The exhibition halls are almost fully booked.
While PCIM Expo & Conference is positioning itself as the central event for power electronics, intelligent drive technology and renewable energy - and is also increasingly becoming the focus of electronics production following the discontinuation of SMTConnect - 'Sensor + Test' and the SMSI Congress (Sensor and Measurement Science International) offer specialist information and innovations in sensor and measurement technology.
PCIM Expo & Conference
Prof. Dr. Dushan BoroyevichThePCIM Expo & Conference can point to impressive registration figures. Last year's event already boasted over 18,100 visitors, 637 exhibiting companies and 952 conference participants. This year, over 650 exhibitors - including 120 new exhibitors, for example from Japan, France and Italy - will showcase developments and technology trends and promote industry-wide and international exchange. Following the successful PCIM 2024, the trade fair has been expanded by two additional halls to a total of six in order to offer suppliers even more space to present their innovations and developments in power electronics to an international trade audience.
The accompanying PCIM conference offers a comprehensive program. Prof. Dr. Dushan Boroyevich, Virginia Tech/Virginia Tech's Center for Power Electronics Systems (CPES), will give the opening keynote on Tuesday, May 6, 9:45 - 10:30 a.m., Brussels 1 Hall, NCC Mitte, on the topic of 'Medium Voltage Power Electronics Building Blocks for Future Electronic Energy Network' - a topic that should be of interest to many in view of the fluctuating challenges in the energy sector.
The conference sessions offer more than 400 presentations on topics such as SiC MOSFET, packaging, converter design, monitoring and testing, virtual prototyping, IGBT, semiconductor technologies, passive components and thermal management. Below we present a selection of interesting presentations from the program, which can be read in full on the PCIM website.
https://pcim.mesago.com/, https://pcim.mesago.com/nuernberg/en/conference.html
Please note the talk of the month in the online article Talk of the month: Franziska Hesse, Team Manager of PCIM Expo, "Experiencing the energy at PCIM is unique."
Information for subscribers
PLUS accompanies the trade fair association as a media partner and is represented at PCIM with a stand (Hall 4, Stand 401).
Please also see our online special with specialist information, articles and a presentation of selected exhibitors:
www.leuze-verlag.de/plus-2/pcim-expo-und-sensor-test-special-2025
Selected presentations of the PCIM Expo & Conference Session: SiC MOSFET
- Tuesday, May 6, 2025, 11:00 - 12:00 a.m.,
Brussels 1, NCC Mitte
- Session: SiC MOSFET
The one-hour session on silicon carbide-based field-effect transistors (SiC MOSFET) will be chaired by Prof. Dr.-Ing. Thomas Basler, Head of the Faculty of Electrical Engineering and Information Technology at Chemnitz University of Technology. Hidetaka Matsuo, Mitsubishi Electric, will speak about the results of current-voltage tests to investigate the bipolar degradation of SiC MOSFET modules and the safe use of high-reliability body diodes. The reliability tests were conducted on 477,520 second-generation planar SiC MOSFETs and confirmed that the probability of VDS(on) drift is within 100 ppm for 600 A modules.
Also, Shunsuke Asaba, Toshiba, talks about the dynamic behavior of SBD embedding in SiC MOSFETs with planar gate structure when high temperatures occur. And Ainhoa Puyadena Mier, Infineon Technologies Austria, will explain in her presentation how the efficiency and lifetime of MOSFETs could be improved by his company's 1200 V CoolSiC M2 Easy C and XT interconnect technology.
Prof. Dr.-Ing. Thomas Basler (Image: mesago)- Wednesday, May 7, 12:50 - 13:10,
Technology Stage, Hall 4, Stand 435
- Presentation: Wire bondable surfaces in power electronics (PLUS Insights)
Stefan Schmitz, CEO of BOND-IQ, Berlin, talks about the continuing importance of wire bonding, which is indispensable in power electronics despite ongoing miniaturization and performance increases. Wire bondable surfaces must offer an optimum combination of electrical conductivity, mechanical stability and resistance to ageing and corrosion processes. In his lecture, the most important industrially established metallizations for wire bonding will be presented, including electroless Ni/Au (ENIG), electroless Ni/Pd/Au (ENEPIG), electroplated layers and direct copper bonding (DCB) on ceramic substrates. In addition to the material pairings, typical sources of defects and their effects on the bond quality will be discussed, and the factors influencing service life and process reliability will be shown.
- The lecture is presented by our trade journal and is aimed at experts from electronics production, materials scientists and interested parties from research and development.
Stefan Schmitz (Image: BOND-IQ)
- Thursday, May 8, 12:30 - 12:50 p.m.,
E-Mobility & Energy Storage Stage, Stage,
Hall 6, Stand 220
- Presentation: Enhancing xEV Systems with Analog Semiconductor Solutions
Kathleen Gao, NOVOSENSE Microelectronics, will present new trends in e-automobility from the perspective of analog semiconductor solutions, with a focus on product and technology iteration of EV powertrains and body control systems. Important innovations in automotive semiconductor technology, especially in the field of isolation and gate driver devices, will be discussed. A lecture at the interface between electrical and energy technology that should be worthwhile.
Kathleen Gao (Image: mesago)
SENSOR+TEST 2025 with a top-class supporting program
Elena SchultzTheSENSOR+TEST trade fair focuses on professional competence. The exhibitors' booking situation is promising and the organizers expect a significant increase in visitor numbers. Visitors can expect a fully booked Hall 1 as well as a Plaza as a central meeting and exchange platform in Hall 2.
A special highlight is the diverse program of events. The focus will be on the established Innovative Calibration Area, two high-caliber forums with numerous best-practice presentations, the new Condition Monitoring lecture series, the special 'Young Innovators' area and the SMSI 2025 - Sensor and Measurement Science International Conference. A special highlight is the new 'Condition Monitoring' lecture series. Visitors will gain first-hand insights into how innovative sensor and measurement technology is used in practice to increase efficiency and safety in various industries. "Condition monitoring and predictive maintenance are no longer visions of the future, but essential factors for the competitiveness of companies. The SENSOR+TEST 2025 brings together leading experts and the latest technologies in these fields," says Elena Schultz, Managing Director of the organizer AMA Service.
SMSI Conference
Parallel to the trade fair, the third SMSI - Sensor and Measurement Science International Conference, organized by AMA Service, will take place in the Congress Center West of the NürnbergMesse. This still young format brings together national and international representatives from research, science, industry and government institutions. Experts and young scientists from various countries will present their latest research findings and discuss ideas and future trends. Sensor and measurement technology are heavily dependent on innovations from research and development. The current status will be presented at SMSI 2025. With over 200 lectures and presentations, the conference offers an in-depth look into the future of technology.
Selected exhibitors PCIM Expo
Alpha and Omega Semiconductor
Alpha and Omega Semiconductor Limited (AOS) is a developer and supplier of power semiconductors for areas such as portable computers, flat screen televisions, LED lighting, smartphones and automotive electronics. In Nuremberg, the company will be presenting developments in the field of power management solutions. In particular, the Intelligent Power Module of the IPM3 series. The series offers high efficiency, low electromagnetic interference (EMI) and robust reliability for inverter-controlled large appliance applications, including air conditioners, washing machines, heat pumps and fan motors.
Hall 9, Stand 539
ALPHA-Numerics
ALPHA-Numerics specializes in electric cooling and offers consulting and software tools. At PCIM, they will be presenting new solutions for simulating and analyzing electronics cooling, such as the CFD software 6SigmaET. The software offers the electronics industry a tool for simulative analysis of temperature, pressure and flow velocity. It enables realistic modeling that takes environmental conditions and material properties into account. This makes it easier and safer to calculate the heat development of components and the overall thermal management of products.
Hall 9, Stand 438
ALPS ALPINE EUROPE
Alps Alpine specializes in the manufacture and marketing of electromechanical components. Its products and services cover various sectors including automotive, consumer electronics, mobile devices and gaming markets.
Hall 5, Stand 316
Arrow Electronics
As a supplier, Arrow Electronics supports more than 210,000 innovations from technology manufacturers and service providers. The company will be presenting power electronics solutions for energy-efficient heat pumps, fast charging systems for electric vehicles and on-board charging solutions for the automotive sector. Arrow will also be presenting semiconductor technologies based on silicon carbide (SiC) and gallium nitride (GaN), which optimize system efficiency and power density.
Hall 4A, Booth 211
Aurubis
Aurubis is a copper recycler and supplier of non-ferrous metals. The company will present its copper products for power electronics at PCIM. These products support the industry in handling high power and current levels. A highlight will be the high-precision copper strips, wires and profiles for power engineering applications, including copper-ceramic substrates, heat sinks, busbars and connectors.
Hall 6, Stand 422
Beck Elektronik
The distributor of electronic components ' presents its latest products and solutions in the field of power electronics. As a highlight of the trade fair, the company will be presenting the '900A/1200V power module with pin fins'. The half-bridge module from 'Leapers Semiconductor' is ideal for water cooling thanks to its pin fins. With the Si3N4 AMB substrate, it offers better mechanical strength with higher thermal conductivity and the integrated chips from 'HHgrace' enable an independent supply and thus represent an alternative to established chip sources.
Hall 7, Booth 100
budatec
budatec is a machine manufacturer for the semiconductor and solar industry. The company's portfolio includes vacuum soldering systems for various series sizes, sintering systems and customized machines and tools. In addition, budatec offers technology consulting for vacuum soldering systems and sintered joints.
Hall 5, Stand 335
Cambridge GaN devices
Cambridge GaN Devices (CGD), a spin-off from the University of Cambridge, is a semiconductor company that develops energy-efficient GaN-based power devices. At PCIM 2025, CGD will present a range of new products and developments. These include the 650 V GaN product family, which is based on ICeGaN™ technology and enables simple control with standard MOSFET drivers. The company will also showcase new GaN power IC packages that offer improved thermal performance and increase system reliability.
Hall 7, Booth 657
CeramTec
CeramTec, a supplier of high-performance ceramics, will be presenting its latest developments. A special highlight is the first presentation of the new silicon nitride ceramic substrate. This material offers a reliable solution for applications in high-performance electronics, including electric vehicles, vehicle electrification, industry and renewable energy. It is characterized by high flexural strength (≥ 700 MPa), fracture toughness (≥ 6.5 MPa*√m) and dielectric strength (≥ 25 kV/mm). With a thermal conductivity of 90 W/mK, it is also ideal for WBG dice in high-performance modules.
Hall 7, Stand 540
Cicor
Cicor is a global provider of complete electronic solutions, from research and development to production and supply chain management. With around 2,500 employees at 15 locations, the company serves customers from Bronschhofen, Switzerland in the medical, industrial and aerospace sectors.
Hall 4, Stand 419
FELDER
Felder will be presenting the ISO-Flux Clear no-clean electronics flux series for Pb-free soldering applications using foam and spray fluxers at PCIM. It is characterized by high spreading, good wetting and a long shelf life of up to two years. It has passed the SIR test with high resistance values.
Hall 4, Stand 310
F & K DELVOTEC
F & K DELVOTEC Bondtechnik is a provider of assembly and connection technologies and develops complete solutions for partial or full automation in the field of wire bonding for customers in the semiconductor, e-mobility, photovoltaic and automotive industries. Due to the physical limits of the current carrying capacity of wire bond connections, the company has developed laser bonding, a robust and reliable technology for joining aluminum and copper tapes on DCB and other substrates.
Hall 6, Stand 241
Fritsch GmbH: Everything in SMT from a single source!
Fritsch GmbH
Kastnerstraße 8
92224 Amberg
Phone +49 9621 78800-0
www.fritsch-smt.com
Fritsch systems are ideal for the construction of high-quality prototypes and small to medium-sized series. They are used in development, at universities and in research, as well as for newcomers to SMT production.
The core segments of Fritsch GmbH are adaptive, highly flexible SMT solutions and sophisticated dispensing systems, which are suitable for a wide variety of applications such as jetting solder pastes, adhesives, insulating and filling materials, activators, paints, etc.
The fully and semi-automatic machines are equipped with sophisticated software packages that are optimized for the daily needs of production. The high level of intuitive user-friendliness is also unique.
Text: Fritsch GmbH
Hall 4 | Stand 205
Fuji Electronics
Fuji Electric Europe was founded in 1987 in Germany and is a 100% subsidiary of Fuji Electric, Japan. The company has been supplying the European market with power semiconductors for energy conversion systems for over 30 years. The product range includes power semiconductors, devices, modules and discrete semiconductors, wide band-gap semiconductors (SiC, GaN, GaAs), diodes, rectifiers, IGBTs. Integrated power modules and MOSFETs.
Hall 7, Stand 434
Gemballa Electronics
Gemballa Electronics has been active in the fields of power electronics, drive and control technology for more than 45 years. The portfolio includes passive components, integrated passive components, fuses and protection elements (Eaton Bussmann Series), DC switches and power resistors (Danotherm).
Hall 9, Stand 452
Plasmatreat GmbH: More efficient, sustainable and cost-saving
Plasmatreat GmbH
Queller Str. 76-80
33803 Steinhagen
Tel. +49 5204 9960-0
www.plasmatreat.com
Plasmatreat will be presenting pioneering plasma solutions for the manufacture of power electronics at Stand 169 in Hall 7. Openair-Plasma® technology ensures optimum process reliability and quality in the manufacture of power modules: the technology removes oxide layers from metal surfaces inline, removes organic and inorganic impurities and thus improves adhesion. The plasma coating also prevents delamination. Plasma also optimizes heat dissipation, which extends the service life of the modules. The process is environmentally friendly without the use of chemicals and reduces reject rates. Manufacturers thus benefit from more efficient, sustainable and cost-saving processes.
Text: Plasmatreat GmbH
Hall 7 | Booth 169
ROGERS Germany
Rogers supplies power electronics solutions for energy-efficient motor drives, vehicle electrification and alternative energy, elastomer material solutions for sealing, vibration management and impact protection in mobile devices, transportation equipment, industrial equipment and performance apparel, as well as RF solutions for wireless infrastructure, vehicle safety and radar systems. In Germany, the company specializes in ceramic substrates (DCB & AMB) made of ceramic and copper as well as microchannel coolers.
Hall 9, Stand 446
LeitOn
Leiton offers solutions for the electronics industry and specializes in the development and production of high-quality printed circuit boards. The product portfolio includes power semiconductors, components, modules and discrete semiconductors, measurement and testing technology, prototyping, technical consulting services, integrated circuits, passve components, thermal management, sensors, assemblies and subsystems.
Hall 5, Stand 201
SPEA
SPEA has been inventing, developing and manufacturing automated test systems for semiconductor ICs, MEMS and electronic assemblies since 1976. With its systems, the company offers its customers solutions for the efficient testing of electronic components.
Hall 4a, Booth 107
SpeedPox: The fastest epoxy resin solution on the market
SpeedPox GmbH
Holz-Steiner Str. 6, Objekt 4a
A-2201Gerasdorf bei Wien
Tel.: +43 2246 50701
www.speedpox.com
SpeedPox® offers innovative epoxy-based material solutions with the fastest curing speed on the market (120 °C snap-curing system) and the unique UV curing technology with deep curing for epoxy systems.
Efficient self-curing reduces process times and costs by up to 99 %. This ensures the competitiveness of our customers in the production of electronic components. Our products include the protection of electronic components and assemblies, electrically conductive adhesives and inks. All products are based on our patented hardener technology. A one-component solution with infinite processing at room temperature.
Text: SpeedPox GmbH
Hall 4 | Booth 336
Tresky
Tresky produces high-precision placement systems in Hennigsdorf near Berlin and has 40 years of experience in the semiconductor market. Products include epoxy bonders, UV bonders, ultrasonic bonders, thermocompression bonders, sintering bonders, flip-chip bonders, eutectic bonders, 3D bonders and photonics bonders.
Hall 5, Stand 335
Selected exhibitors SENSOR+TEST
Bayern Innovativ
Bayern Innovativ is an institution of the Free State of Bavaria for the promotion of small and medium-sized companies, for example through digital innovation platforms, technology scouting and roadmapping. The focus is on the energy technology, automotive, new materials, health, medical technology, textiles and cultural and creative industries clusters. Bayern Innovativ also promotes knowledge transfer through modern communication channels and self-learning digital platforms.
Hall 1 Stand 1-430
InfraTec
InfraTec is an owner-managed company with over 240 employees and develops products in the field of thermal imaging technology, including the ImageIR camera series and VarioCAM HD, thermographic automation solutions for quality assurance in automotive production and non-destructive testing of electronic assemblies. In the field of infrared sensor technology, InfraTec develops pyroelectric detectors for gas and liquid analysis, flame detection and spectroscopy.
Hall 1 Stand 1-413
LINTEC Advanced Technologies
LINTEC optimizes semiconductor production with tailor-made adhesive films and systems for back-end manufacturing. The portfolio includes fully and semi-automated equipment, including wafer mounters, UV imagesetters, back-grinding tapes, tape laminators and peelers, as well as tapes such as dicing tapes, back-grinding tapes, backside coating tapes and dicing die bonding tapes. Adwill brand dicing tapes include UV-curable dicing tapes that secure wafers during the dicing process. The tape is reduced by UV irradiation to facilitate wafer pick-up. This improves the quality of chips of different sizes during full-cut dicing.
Hall 1 Booth 1-430
