In Munich, the electronics industry not only showed that digital technologies are the key to aCO2-neutral future and much more, but also that the industry is set to continue growing thanks to its innovations. The mood was correspondingly positive - significantly better than in other sectors and expected by many in advance.
At the world's leading trade fair, 3,480 exhibitors, 76% of whom came from abroad, presented their innovations from the entire spectrum of electronics to around 80,000 visitors from around 100 countries. In addition to sustainability, key topics included artificial intelligence, future mobility and young talent. Innovations were presented primarily in the areas of chiplet technology, power electronics, high speed, high performance and ecosystems.
High-caliber kick-off
There were already two program highlights on the day before the trade fair. The electronica Automotive Conference brought together international experts and managers from the entire supply chain to discuss the current challenges facing the industry. This was followed in the evening by the CEO Roundtable with CEOs Jean-Marc Chéry, STMicroelectronics, Jochen Hanebeck, Infineon Technologies, and Kurt Sievers, NXP Semiconductors, as well as invited guest Barbara Bergmeier, Executive Director Industrial Operations at Jaguar Land Rover. Topics included the status of Europe compared to the USA and Asia, resilient supply chains and the impact of AI on the electronics industry. Among other things, they emphasized the importance of international cooperation in the chip industry and discussed how artificial intelligence can contribute to stable supply chains.
Press conference at the opening offered a review and outlook
Dr. Gunther Kegel and Dr. Reinhard PfeifferClaudiaGrzelke, PR Manager of electronica, opened the press conference with a look back at the beginnings of electronica in 1964. Dr. Reinhard Pfeiffer, Managing Director of Messe München, then presented facts and figures on the current electronica and discussed its focus topics and the supporting program. After the statement "The beauty of trade fairs is the competition", ZVEI President Dr. Gunther Kegel addressed the economic situation in the industry. He expects growth again next year. Because everything will be realized with AI, and: "The target image of the All Electric Society is still correct. The megatrends are here to stay." After all, growth cycles are nothing new in the electronics industry. After the boom following the pandemic, the components market slumped by 13% in 2023 and by 12% in 2024, with a double effect on the semiconductor market. A rapid recovery and further growth will require a reduction in electricity prices, as this will promote efficiency and innovations for decarbonization and digitalization.
Consistently positive results
After the four days of the trade fair, Dr. Reinhard Pfeiffer drew the following conclusions: "This year's trade fair at the technology hub of Munich once again impressively demonstrated the innovative strength of the industry. It was possible to experience how future technologies are already taking shape today - from intelligent energy solutions to smart mobility - and what a decisive role the electronics industry plays as a driver on the way there."
Full aisles on Tuesday afternoonAlthoughthe electronics and digital industry is currently in difficult waters, the current economic slowdown does not call into question the megatrends of electrification, digitalization and automation or the vision of the All Electric Society, said Dr Gunther Kegel, President of the German Electrical and Electronic Manufacturers' Association (ZVEI), commenting on the current situation in the industry. "I am certain that things will pick up again, including for electronic components, which have seen a significant drop in sales after some very good years in Germany. It is important that the general conditions in Germany improve quickly."
"electronica 2024 was more international than ever," said Project Manager Katja Stolle. "We are delighted that the trade fair returned to the high level it was at before the pandemic and that the mood was very positive despite the challenging times. Walking through the halls and talking to people, you could once again feel the typical electronica spirit," added Caroline Pannier, Deputy Exhibition Director, who will take over the management of electronica in December.
"Held strategically alongside electronica, Semicon Europa brought together industry leaders from across the supply chain to provide insights into the advances that are driving sustainable growth in the semiconductor sector," said Laith Altimime, President of SEMI Europe. "Record attendance and a sold-out show floor - SEMI is very pleased with this year's results."
The results of the trade fair survey also confirm how satisfied the participants were with the trade fair. "electronica 2024 has set new standards in its 60th anniversary year: sold-out halls, qualified customer meetings and excellent visitor numbers," says Philip Harting, Chairman of the Advisory Board of electronica and CEO of the Harting Technology Group. "electronica is the beacon and dynamic, innovative driving force of the international electronics industry. We are already looking forward to electronica 2026."
Nicolas SchweizerTorstenJanwlecke, COO and Member of the Management Board at Phoenix Contact, said: "In its anniversary year, the world's leading trade fair electronica breathes the spirit of the future vision of an All Electric Society, which could be felt everywhere and makes us very happy: With this target image, we have aligned our entire corporate strategy to drive forward climate protection and decarbonization in particular. electronica offered us an ideal platform to exchange ideas with our customers about possible solutions."
Nicolas Schweizer, CEO of Schweizer Electronic, concluded: "electronica has been, is and will remain the world's most important trade fair for the electronics and digital industry for 60 years. This is where connection, networking and innovation are created in order to achieve our goal, the All Electric Society."
Selection of new products reflects diversity of trade fair topics
Allegro MicroSystems presented its new inductive position sensors and a range of magnetic micro current switches and interlocks. These reduce system costs, extend battery life and provide reliable performance in a variety of automotive, industrial and consumer applications. The new APS11753 and APS12753 magnetic microswitches and interlocks redefine position sensing with higher sensitivities and ultra-low power consumption (50% less power consumption than existing Micropower products).
Altium has introduced three new products, Altium Discover, Altium Develop and Altium Lifecycle. Together they offer a complete ecosystem for the development of electronic products, from design and manufacturing to lifecycle management.
Altium Discover offers a trust-based, collaborative ecosystem that brings together semiconductor manufacturers, distributors and product developers on a unified platform. It leverages the proven cloud capabilities of Altium 365 to enable transparent, real-time collaboration and ensure that everyone in the supply chain can work together with confidence. The new platform streamlines workflows and ensures transparency throughout the product lifecycle.
Altium Develop is designed for SMEs to unite electronics, mechanical and software design into a single workflow. This integrated approach supports concurrent engineering, reducing development cycles and costs while promoting efficiency and innovation. Altium Develop offers turnkey functionality that is easy to use and easy to buy.
Altium Lifecycle provides comprehensive lifecycle control, ensuring accurate management throughout the product lifecycle. With comprehensive compliance and audit trail capabilities, it helps companies comply with regulatory requirements and maintain high reliability throughout the lifecycle of their products.
ATEcare was again represented together with partners and a selection from its product portfolio. These included the VP01G (3D-SPI) and VT-S1080 (3D-AOI) inspection solutions from Omron. The AI-based auto-programming of the 3D AOI systems enables almost fully automatic program creation. Information was also provided on the Omron 3D SPI's Multiple Resolution Switch, which ensures flexible adjustment of the resolution according to the pad size to be inspected, and Omron's new VT-X950 and VT-X850 3D CT AXI systems, which generate real 3D volume data instead of just 2D data in different sectional planes.
Elemaster provided information about AI and robot technology
The new PerSpectrial laboratory system from Wickon Higtech, which can be equipped with various inspection heads, enables 3D inspection with lateral resolutions from 2.5 to 12.5 µm.
IPTE showed its new flash programming station, which has several vertically arranged test positions. This solution increases testing efficiency by allowing multiple products to be processed simultaneously, significantly reducing cycle times, and the EOL tester could also be seen in action. This robust test solution is specifically designed for high power consumption applications and ensures maximum product reliability and performance.
JBC Soldering SL presented the battery-powered B-IRON system, which redefines precision soldering with mobility and efficiency. This is because it offers everything (monitoring and control, cartridge changer, soldering tip cleaning, tool holder, charger) in one portable device. It was developed for professionals and reaches a soldering temperature of 350°C in less than 3 seconds. The cartridge changing system (over 30 shapes) improves the workflow, while the intelligent thermal management extends the life of the soldering tip by reducing the temperature when idle. The integrated charging system allows to realize over 500 solder joints per charge and autonomy for remote tasks.
Illustrious panel discussions at the joint stand of Elekonta Marek and MPMMPMEnvironment Intelligence provided information about their innovative recycling technology and sustainable recovery solutions. These include the recycling of base material, bare and assembled PCBs, electronic scrap and metal-containing dust. The company is a certified waste management company (primary treatment facility ElektroG) and offers additional services.
Polar Instruments provided information on the following current products:
- GRS200 manual fault diagnosis system for electronics repair
- Flying Probe repair test systems for electronic assemblies
- Design and test tools for impedance controlled printed circuit boards
- ATLAS VNA attenuation measurement system for printed circuit boards
- Flying prober for automated signal integrity analysis
- IST reliability test systems for printed circuit boards
Provertha has expanded its circular connector portfolio with a new angled M12 ruggedized connector series for PCB assembly in SMT connection technology - the first angled M12 connector for the automated SMT process on the market. A high-temperature-resistant suction cap fixes the angled ruggedized connector in the exact horizontal and right-angled position for the reliable SMT soldering process. The new Ruggedized 90° versions - either unshielded or shielded with a one-piece shield spring - feature a new design with robust large-area SMT connections and an extremely low installation depth, resulting in a very small footprint on the PCB.
Renesas presented a new generation of system-on-chips for the integration of multiple automotive applications, such as Advanced Driver Assistance Systems (ADAS), In-Vehicle Infotainment (IVI) and gateway applications, on a single chip. The R-Car X5H SoC is the first device in the R-Car X5 series and is based on the latest 3nm process technology. It offers the highest level of integration and performance and is one of the first of its kind in the industry. Thanks to its unique hardware-based isolation technology, it enables highly integrated, secure processing solutions for multiple automotive domains on a single chip. In addition, the new SoC is characterized by the ability to increase AI and graphics processing performance using chiplet technology.
Samtec demonstrated on the stand the capabilities of its new Flyover QSFP systems, which offer improved signal integrity and architectural flexibility
Samsung Semiconductor Europe showcased next-generation semiconductor technologies for artificial intelligence, automotive and other applications. Under the motto "Crossroads: Where the future begins", the focus was on advanced technologies and how they open up new possibilities in various application areas, including high-performance computing, servers, data centers, automotive and consumer electronics. Visitors learned first-hand how Samsung is shaping the future of innovation with semiconductor and display technologies. Products and demos from various business fields illustrated the company's commitment to exploiting the potential of AI.
Schurter presented its latest product line of high-performance, prismatic supercapacitors (supercaps). The innovative energy storage devices were very well received and set new standards in the industry with a thickness of just 0.4 mm. Schurter thus offers the world's thinnest supercaps with high power density. The product line comprises three different products in over 40 variants at the start, which have both a high energy density and a compact design.
Seica presented modern solutions for the electronics industry, including the Flying Probe Pilot VX test platform and the Compact SL needle bed tester. Both can be fully automated and combined on the same line thanks to the integrated VIVA platform to optimize throughput or to use different technologies and performances to achieve maximum test coverage with minimum test time. The MINI 80 test solution, which is part of Seica's VIVA Integrated Platform, was also on display. This cost-effective platform for developing customized ICT reference and functional tests also offers a wide range of integrated instruments, switching matrices and user power supplies.
Viscom 's presentation focused on the two inspection systems iS6059 PCB Inspection Plus and iX7059 PCB Inspection XL. Information was also provided on the latest vAI AI solutions, updates to the vConnect networking, monitoring and service software and the new vAcademy online academy.
The premium AOI system iS6059 PCB Inspection Plus offers outstanding inspection performance thanks to its camera module, which captures up to 26% more pixels and enables inspection from as many angles as possible thanks to a total of nine different views. With variable lighting, larger tilted image fields and increased data transfer rates, the system delivers up to 25% faster images.
The iX7059 PCB Inspection XL X-ray system sets new standards in the inspection of SMD and THT solder joints. With its ability to precisely measure voids, it guarantees one hundred percent quality assurance. The system identifies
concealed defects even in the case of heavy shadowing of complex assemblies, making it an indispensable tool.
Press tour of the Viscom stand
Against the backdrop of increasing networking and electrification, the demand for cabling is growing across all industry segments. With KabelkonfektionPlus, Werner Wirth offers an answer to this challenge in an economical and application-specific way. This is because KabelkonfektionPlus goes beyond the pure service of classic cable assembly. The Hamburg-based company supports cabling concepts from prototype to series production with comprehensive product engineering. It thus serves the market trend towards individualization in cable assembly. Among other things, Werner Wirth is able to combine cabling concepts with customer-specific housing elements or electronic components. This helps to reduce the number of suppliers and supports customers in mitigating the shortage of skilled workers. Werner Wirth's range of services includes everything from individual wires to complex cable systems, including overmoulding, component encapsulation, product-specific injection-moulded parts or integrated electronic components.
Yamaha presented its new VP-01G-Y 3D SPI system and its new YRi-V 3D hybrid AOI system. The latter is characterized by its high speed (up to 56.8cm2/s) and resolution (5µm) and can be used for a wide range of applications.
Semicon Europa also successful
Semicon Europa, which focused on semiconductor manufacturing and packaging, also took place in two halls at the same time as electronica and was also very successful.
Further information on this and electronica 2024 will be published in the second part of our follow-up report in the January issue. There we will also discuss the presentations we attended and other trade fair highlights and company innovations.
Gustl Keller
High proportion of Chinese exhibitors
The proportion of Chinese exhibitors was high again this year - an entire hall was reserved almost exclusively for them, and you could definitely see a difference between business cultures. On the one hand, one was surprised by the 'visual marking' - presumably provided by the trade fair - with identical red and gold China banners, which made the geographical origin immediately recognizable - unlike their competitors from Europe or other regions. On the other hand, many Chinese business people and their trade fair hostesses promoted their products very enthusiastically, almost offensively - even in the hall entrances one was surprised by the offer of "cheap PCBs". This did not go down well with all trade fair visitors.
PLUS sought to talk to them. This led to a friendly exchange with Aaron Ho from the company PCBA Store in Shenzen. He reported that PCBA Store never misses the Munich trade fair and that it is extremely important for business exchanges. His companion presented the incoming online orders from European customers who order their PCBs from PCBA Store on her smartphone - estimated at 20-second intervals. They experienced the trade fair as extremely important, exciting and impressive.
Red and gold banners marked the many Chinese exhibitors at the trade fair
Aaron Ho, Vice General Manager PCBA Store, and companion
Markolf Hoffmann
Trade fair impressions of selected exhibitors
Günther Ziegler, Kingshine Europe
The Kingshine team at electronica
How did you find the atmosphere at electronica this year?
electronica in Munich was one of the best trade fairs I have attended in my professional career. The positive atmosphere and the lively exchange on innovative topics and technologies were really impressive.
Was the trade fair a success for Kingshine?
Our first appearance with 'Kingshine Europe' and a new exhibition stand was a great success. In addition to our European team, colleagues from China were also present, which strengthened our presence. The exchange with new industry contacts and old acquaintances was particularly valuable.
What was your personal highlight of the trade fair?
The fact that numerous visitors came to our stand to find out about PCBs and complex logistics concepts. The focus on solutions for battery management and storage media was particularly interesting. The presence of our owner, Mrs. Zheng, was also a highlight.
How has the market entry in Europe gone so far?
We are in the midst of following up on the trade fair and have received promising contacts and direct inquiries in the PCB sector.
How has the new Kingshine concept been received?
Initial reactions have been positive, but the long-term success will only become apparent in the coming months. We are confident that our concept will catch on.
Interview: Andi Frey
Harald Eppinger, Koh Young Europe
Koh Young team at SEMICON Europe
How did you find the atmosphere at SEMICON Europa this year?
That's not easy to answer, very cautious optimism, with the postscript "it has to get better".
Was this year's trade fair a success for Koh Young?
We attend a lot of trade fairs, so we can make good comparisons. electronica was good, but Semicon with its own stand was much more promising. The demand for our new products was high.
What was your personal highlight?
60 years of electronica, hats off, all halls fully occupied! That confirms a solid and innovative trade fair concept. Trade fairs are still valuable if you can offer visitors and exhibitors something.
Interview: Markolf Hoffmann
Thomas Miklau, cms electronics
Koh Young team at SEMICON Europe
How did you find the atmosphere at electronica this year?
The trade fair was inspiring and lively. New technologies and solutions were met with great interest. It was clear to see that the industry is actively tackling the challenges of the future in order to develop sustainable solutions.
Was the trade fair successful for cms?
We were able to make numerous promising initial contacts and hold important discussions with existing customers. Our active participation in panel discussions and presentations, which underlined our innovative strength in the EMS sector, was particularly positive.
What was your personal highlight of the trade fair?
Mr. Velmeden's participation in the ZVEI panel discussion and Mr. Ondrisek's presentation were highlights. Our vision of more sustainable electronics production and the response to our pcbwhiz platform were met with great interest.
What is your forecast for 2025?
2025 will be characterized by sustainability, digitalization and faster development cycles. Close partnerships between development and production will be key - an area in which we believe we are already well positioned.
Will there be innovations at cms in 2025?
We are continuing to develop our tools to optimize collaboration between customers, development teams and production. The aim is to shorten development times and further increase the energy efficiency of our products.
Interview: Andi Frey
The PCB butterfly from Contag - attracted numerous visitors to the stand.
essemtec showed impressive results from its SMD pick-and-place machine Puma
Big crowd at Vision Engeneering - where the new OPTA stereo microscope with eyepieceless design was also presented
LeitOn's hip 'electrification bar' quickly became the center of attraction at the trade fair
A good mood prevailed at the MOS electronic stand
