The 'Microdisplays & Sensors' business unit of the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS with retroactive effect from January 1, 2024. Both institutes are closely networked, particularly through the aforementioned business area, and share infrastructures at the Dresden site. The change allows the Fraunhofer FEP, as a process-oriented institute, to focus more strongly on its expertise in electron beam and plasma technology. This will provide technological offerings for the growing demand for solutions for energy and sustainability as well as life science and environmental technologies for industry and society now and in the future.
With this organizational change, the Fraunhofer-Gesellschaft expects not only optimal use of the existing infrastructure for microdisplay technology in Dresden, but also greater opportunities in the acquisition of projects within the framework of the Microelectronics Alliance. In future, the Fraunhofer IPMS will focus more intensively on the area of heterogeneous integration of various chiplet technologies in conjunction with CMOS microelectronics. This future-oriented technology also includes the integration of organic semiconductors, e.g. OLED, and novel emitter technologies such as µLED.
www.ipms.fraunhofer.de
www.fep.fraunhofer.de
