At Productronica 2021 (B3 222), Ventec International will be presenting its high-performance aerolam portfolio with substrates for tough requirements in aerospace and military applications. This applies to the transmission of high-speed digital signals at high frequencies, reliable heat dissipation and extreme environmental stress. The materials are supported by extensive documentation, such as test procedures and conformity certificates. The aerolam portfolio is designed for the full range of these applications, from equipment for command and control centers to systems for field use that must operate under harsh operating conditions such as extreme temperatures, high vibration loads and G-forces, salt spray and humidity.
Ventec's tec-speed 20.0 and tec-speed 30.0 prepregs and laminates are low-loss materials that meet IPC 4103 specifications and are suitable for multi-GHz applications up to the V/W band and into the millimeter wave region. The tec-thermal IMS product families, laminates and prepregs offer very good thermal performance. VT-4B1 and VT-4B5SP are aimed in the same direction. The tec-pack IC package substrates meet the requirements of lightweight and extremely thin components for smartphones, laptops, wearables and special mil-aero applications.
For high mechanical stability requirements at high temperatures, Ventec offers the UL-94 V-0 compliant VT-901 polyimide substrate with high flexibility, high Tg value, low CTE in the Z-axis and good T260 and T288 value for dimensional stability and integrity under harsh conditions. VT-90H is a highly reliable and cost-effective non-brominated polyimide with high temperature and fracture resistance, low CTE and UL-94 flammability with HB rating according to global defense and aerospace standards. VT-447V is a halogen-free phenolic laminate/prepreg that offers high resistance to CAF (conductive anodic filament) formation at low CTE, high Tg and 150 °C MOT (maximum operating temperature), as well as very good thermal and mechanical stability.
productronica, booth B3-222
