It is based on a one-component, heat-curing epoxy resin. The ceramic filler aluminum nitride achieves a very high thermal conductivity of 1.7 W/(m∙K) (measured in accordance with ASTM D5470). This is comparable to silver-filled ICA adhesives (ICA = Isotropic Conductive Adhesives), which have a thermal conductivity of ~1.5-2.0 W/(m∙K). One advantage over ICA adhesives is the simultaneous electrical insulation.
When cured, Monopox TC2270 exhibits compressive shear strengths of 34 MPa on the FR4 composite and 11 MPa on the high-performance plastic LCP. If microchips are bonded, the electronic adhesive achieves values of 60 N in the die-shear test (1 x 1 mm silicon dies on a gold surface). To determine the moisture sensitivity level (MSL 1), silicon dies were bonded to different PCB materials, stored for a week at 85 °C and 85 % humidity and then subjected to three successive reflow cycles. Even after these stresses, the adhesive retained its high strength level. The temperature range of the adhesive is between -40 and +150 °C.
