Kraus Hardware has been using 3D AOI and SPI from Göpel in combination for several months now, adding a further component to its inspection concept of ICT, BS, FKT and HDR X-ray analysis. "This allows us to offer our customers significantly higher performance," emphasizes Andreas Kraus, Managing Director of the EMS company. The advantages lie in the quality assurance provided by paste inspection: pre-reflow inspection now provides additional information during the actual assembly process, such as component placement, PCB and component feeding. The post-reflow inspection shows the result of the solutions and the overall result of the preceding processes.
Kraus: "With this new investment in the 3D AOI plus SPI system, we are gaining new information for documentation, traceability and process optimization of our electronics production. This enables us to provide our customers with the best possible quality performance in a highly flexible manner and on fair terms."
