
Dr. Bernhard Rebhan ist seit 2024 Prozesstechnologe für Drahtbonden und Testen bei F&S Bondtec Semiconductor GmbH, nachdem er zuvor über 15 Jahre bei EV Group im Bereich Waferbonden tätig war.
BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) enables a rapid assessment of the reliability of thick-wire bonds for ...
Eugen G. Leuze Verlag GmbH & Co. KG
Karlstraße 4
88348 Bad Saulgau
GERMANY
Phone.: +49 7581 4801-0
Fax: +49 7581 4801-10
EMail: info@leuze-verlag.de
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