Kupferschichten
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- There are no shipping costs for all individual item purchases or downloads.
- Book shipments within Germany are charged by weight (plus VAT):
Weight in kg
Cost in EUR
up to 0.5 kg
2.50
up to 1 kg
3.50
up to 3 kg
5.50
up to 31 kg
6.90
Book shipments abroad are charged according to weight and priority (plus VAT):
Weight in kg | Economy costs in EUR | Priority cost in EUR |
up to 0.5 kg | 5.00 | 6.00 |
up to 1 kg | 7.50 | 9.00 |
up to 2 kg | 13.00 | 16.00 |
up to 3 kg | 20.00 | 24.00 |
up to 4 kg | 26.00 | 31.00 |
up to 5 kg | 32.00 | 38.00 |
up to 5.5 kg | 37.00 | 44.00 |
up to 6 kg | 39.50 | 47.00 |
up to 7 kg | 45.00 | 54.00 |
up to 8 kg | 52.00 | 62.00 |
up to 9 kg | 58.00 | 69.00 |
up to 10 kg | 64.00 | 76.00 |
etc... |
Information
Over the past two decades, the ability to transfer the outstanding properties of copper, especially its high electrical conductivity, to the surface of non-conductors in the form of thin layers using newly developed and optimised processes has led to enormous advances in electronics and circuit board technology, as well as in other areas.
In the wake of this boom, the number of industrial and contract electroplating companies that deposit high-quality functional copper layers is growing. For this demanding task, they not only need knowledge of the deposition processes, but also need to be as well informed as possible about suppliers of processes, equipment and accessories for the technology.
Users who utilise the properties of copper coatings in their products, as well as institutions and schools involved in development and teaching, have similar needs.
This is the aim of this book, which is intended for anyone involved in the production and application of electroplated copper coatings.
From the contents:
- Copper and its properties
- Electrolytic copper deposition
- Technology of electrolytic deposition of copper and alloys
- Properties of copper and alloy deposits
- Application of electrolytically deposited copper and alloy layers
- Electroless copper layers
- Properties of externally currentless deposited copper layers
- Quality assurance, analysis and process optimisation in copper deposition
- Removal (stripping) of copper and alloy layers
- Recycling and wastewater treatment
- Waste disposal
- Copper in microtechnology
- Copper plating in printed circuit board technology
- Standardisation
Information
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