PERFAG 3D (German/English)

PERFAG 3D (German/English)

SKU : ISBN 978-3-87480-288-8
€89,00
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Information

Edition : First Edition 2016
Pages : 232
Format : DIN A4
Languages : German and English
Quantity

PERFAG 3D applies to the specification of new multilayers for printed circuit board manufacturers. The specification is the result of voluntary cooperation between the PERFAG association and its affiliated printed circuit board manufacturers. The content of the specification is a recommendation that can be followed voluntarily. The PERFAG association is also not liable for any consequences arising from the application of this specification.

The main chapters of PERFAG 3D at a glance:

  1. Base material
  2. Conductor pattern
  3. Plated-through holes
  4. Non-plated holes
  5. Gold plating of contacts
  6. Solder resist masks
  7. Cover layers
  8. Component printing
  9. Carbon paste printing (carbon printing)
  10. Stripping masks
  11. Surface protection
  12. Surface cleanliness
  13. Soldering
  14. Mechanical processing
  15. Abbreviations
  16. Vocabulary

Table of contents

Information

Edition : First Edition 2016
Pages : 232
Format : DIN A4
Languages : German and English
Gewicht : 0.878 kg

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88348 Bad Saulgau
GERMANY

Phone.: +49 7581 4801-0
Fax: +49 7581 4801-10
EMail: info@leuze-verlag.de

 

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