The conference sessions offer more than 400 presentations on topics such as SiC MOSFET, packaging, converter design, monitoring and testing, virtual prototyping, IGBT, semiconductor technologies, passive components and thermal management. Below we present a selection of interesting presentations from the extensive program, which can be read in full on the PCIM website.
- Tuesday, May 6, 2025, 11:00 - 12:00 a.m.,
Brussels 1, NCC Mitte
- Session: SiC MOSFET
The one-hour session on silicon carbide-based field-effect transistors (SiC MOSFET) will be chaired by Prof. Dr.-Ing. Thomas Basler, Head of the Faculty of Electrical Engineering and Information Technology at Chemnitz University of Technology. Hidetaka Matsuo, Mitsubishi Electric, will speak about the results of current-voltage tests to investigate the bipolar degradation of SiC MOSFET modules and the safe use of high-reliability body diodes. The reliability tests were conducted on 477,520 second-generation planar SiC MOSFETs and confirmed that the probability of VDS(on) drift is within 100 ppm for 600 A modules.
Also, Shunsuke Asaba, Toshiba, talks about the dynamic behavior of SBD embedding in SiC MOSFETs with planar gate structure when high temperatures occur. And Ainhoa Puyadena Mier, Infineon Technologies Austria, will explain in her presentation how the efficiency and lifetime of MOSFETs could be improved by his company's 1200 V CoolSiC M2 Easy C and XT interconnect technology.
Prof. Dr.-Ing. Thomas Basler (Image: mesago)
- Wednesday, May 7, 12:50 - 13:10,
Technology Stage, Hall 4, Stand 435
- Presentation: Wire bondable surfaces in power electronics (PLUS Insights)
Stefan Schmitz, CEO of BOND-IQ, Berlin, talks about the continuing importance of wire bonding, which is indispensable in power electronics despite ongoing miniaturization and performance increases. Wire bondable surfaces must offer an optimum combination of electrical conductivity, mechanical stability and resistance to ageing and corrosion processes. In his lecture, the most important industrially established metallizations for wire bonding will be presented, including electroless Ni/Au (ENIG), electroless Ni/Pd/Au (ENEPIG), electroplated layers and direct copper bonding (DCB) on ceramic substrates. In addition to the material pairings, typical sources of defects and their effects on the bond quality will be discussed, and the factors influencing service life and process reliability will be shown.
- The lecture is presented by our trade journal and is aimed at experts from electronics production, materials scientists and interested parties from research and development.
Stefan Schmitz (Image: BOND-IQ)
- Thursday, May 8, 12:30 - 12:50 p.m.,
E-Mobility & Energy Storage Stage, Stage,
Hall 6, Stand 220
- Presentation: Enhancing xEV Systems with Analog Semiconductor Solutions
Kathleen Gao, NOVOSENSE Microelectronics, will present new trends in e-automobility from the perspective of analog semiconductor solutions, with a focus on product and technology iteration of EV powertrains and body control systems. Important innovations in automotive semiconductor technology, especially in the field of isolation and gate driver devices, will be discussed. A lecture at the interface between electrical and energy technology that should be well worth attending.
Kathleen Gao (Image: mesago)
