Researchers at the Fraunhofer Institute for Material and Beam Technology IWS in Dresden are founding DIVE imaging systems. The aim of the spin-off is to commercialize a promising technology that enables precise planar analysis of high-tech coatings in microelectronics or battery factories.
A measuring system developed at the IWS is being used for this purpose, which integrates hyperspectral sensor technology, artificial intelligence and special lighting techniques into a powerful and flexible inspection system. The initial focus is on the semiconductor industry, where stable processes and higher yields are to be achieved. As a center of microelectronics, Dresden is a well-suited location for this. Later, the technology will also be established for the inspection and analysis of surfaces and coatings in other industries. Of the many possible applications, rapid surface layer thickness measurement, the detection and localization of the smallest shape defects or impurities are just a few examples.
Light split into 1000 colors
The DIVE inspection system illuminates the wafers with visible light and infrared radiation at frequencies between 0.4 and 2.5 µm. A hyperspectral camera captures the reflected light. The hyperspectral camera distinguishes between up to 1000 spectral colors or wavelengths. The raw data, the volume of which can quickly grow to several gigabytes, is then forwarded to an artificial intelligence (AI). This AI can detect damaged areas or impurities and also assess the quality of individual chips or the entire wafer. The inspection system can thus determine, for example, whether a coating step on the wafer has been successful and how homogeneous, thin, even or low-defect the layer is. This ensures that only flawless wafers make it to the subsequent production step.
Kick-off project with Infineon
Of course, the wafers in the semiconductor factories are already monitored for many properties during the many production steps up to the final microchip. Analyzing the entire wafer surface is comparatively slow and is therefore often done on a random basis.
This is where DIVE comes in: Together with semiconductor manufacturer Infineon, the team is initially developing a hyperspectral system for laboratories outside the cleanroom and, in the next step, a system that can be used in one. In the future, DIVE is planning an inline solution that can be integrated directly into the cleanroom systems. This will even enable real-time analysis of many process steps.
The four-person team anticipates rapid growth in view of the great potential of this technology. The founders are bringing the complete system concept from the IWS, including the sample lighting and the sophisticated software for system control and AI-supported data evaluation. DIVE will manufacture the designed devices, systems and later entire system components itself in its own production line. The team will also offer services, technical support and customer-specific developments. The spin-off is receiving significant support from the Federal Ministry for Economic Affairs and Climate (BMWK), which is providing funding of €1.2 million.
After the spin-off, the Fraunhofer IWS will continue to develop hyperspectral technology in various directions. The research agenda includes, for example, concepts that use a laser to illuminate the samples or miniaturize hyperspectral systems. The researchers also want to use algorithms to extract significantly more information from the raw data.
