At SMTconnect 2023 in Nuremberg, Viscom AG presented a number of significant innovations in the field of analytics and testing of assemblies and systems - including the 'iS6059 PCB Inspection Plus' system as the successor to the well-known 'S3088 ultra gold'.
Viscom's new 3D AOI system 'iS6059 PCB Inspection Plus''iS6059 PCB Inspection Plus' comes with faster sensor technology, sophisticated data processing and analysis functions for 3D AOI performance. AI-supported software applications and further developments in X-ray inspection were presented 'hands-on' at the stand. Viscom demonstratively pointed out that the product portfolio continues to grow specifically and includes a wide variety of high-performance systems for different production stages and inspection requirements for quality control in electronics production. These include automatically monitored operational stability, location-independent networked condition monitoring, cloud-based solutions, the integration of manufacturer-independent interfaces, audit-proof repeatability at ever higher resolutions and shorter cycle times. iS6059 PCB Inspection Plus' offers appropriate inspection methods to check fully automatically at low cycle times whether the solder joints of the smallest component used are normal or already too thin.
When electronic components on PCBs need to be checked quickly for their presence or the height profiles of assemblies need to be measured, the well-known 3D methods of automatic optical inspection (3D AOI) are the recognized industry standard. Reliable 3D solder joint inspection also plays an important role. This is reliably covered by systems such as the new 'iS6059 PCB Inspection Plus'. It combines nine views in the highest resolution with 26% more pixels than before, variable lighting, larger inclined image fields with the same resolution, as well as further increased data transfer rates with a 25% faster acquisition sequence. Extensive networking options provide the basis for good line-integrated performance.
Artificial intelligence also comes into its own in the production and test flow when it comes to measuring voids in solder joints as part of an X-ray inspection and ruling out defects based on individual factors. Viscom systems such as the 'iX7059 PCB Inspection XL' shown at SMTconnect detect these and other hidden defect types.
Simple measurement of standards and exceptions
