The new LPKF StencilLaser G 60120 increases the working area from 600 mm x 800 mm to 600 mm x 1200 mm.
Users who previously required a cutting area length of more than 800 mm had to realize the cutting process in two steps with mechanical conversion. This applies to product areas such as LED lighting or 5G antennas. These process steps are no longer necessary with the new platform. According to LPKF, the precision of the axis positioning remains at ± 2 µm despite the increased travel distances. Stencil thicknesses are processed, starting with films with a thickness of 20 µm up to sheets with a thickness of 1 mm.
With the help of the automatic frame clamping device, both framed stencils in pneumatic clamping frames and loose stencil sheets can be processed without retooling. With the LPKF software 'EasyEdit', aperture data of the stencils can be adapted individually or in groups. Extensive libraries are available.
The system features automatic cutting gas management. The StencilLaser can also be integrated into automated lines using the SMEMA interface. The system is also available in the 'MicroCut' version, which specializes in particularly fine apertures and increased demands on cutting quality.
