iMaps Announcements 03/2024

iMaps Announcements 03/2024

Following the successful IMAPS Germany Spring Seminar in Ingolstadt at the end of February, we are looking ahead to other highly interesting events that await us as a microelectronics and packaging community. The 20th Device Packaging Conference (DPC) and the Workshop on Advanced Packaging for Medical Microelectronics are taking place in Fountain Hills at the same time as this issue is being published. At the DPC, the three conference days are filled with keynote speeches and parallel sessions on Heterogeneous 2D & 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip and Next Gen Applications. The program is rounded off by 12 Professional Development Courses and discussions on current topics. For example, an entire morning will be dedicated to the effects of the geopolitical situation, with the corresponding session "Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem - Opportunities & Challenges".

Invitation to the Electronics and System Integration Symposium

On 17 April 2024, the 4th Electronics and System Integration Symposium (ESI 2024), organized by the Microsystems Technology Cluster at Landshut University of Applied Sciences and supported by IMAPS Germany, will take place in Landshut. The symposium program offers a total of 25 lectures, which will be presented in the plenary and in two parallel sessions. The spectrum of contributions ranges from issues in assembly and connection technology to innovative sensor concepts and solutions for energy management and the electric drives of the future. All participants at the event will also have access to the digital conference proceedings with scientific papers.

In addition to the presentations, the parallel trade exhibition is also an essential part of the symposium. This platform offers the specialist audience an ideal opportunity to find out about the latest technologies, new research findings and innovative products and services.

Companies, start-ups, scientific staff, graduates and students can present innovative products, new developments and the results of research and development projects in a poster session. The registration deadline for the poster session is March 29, 2024.

Here is an overview of the event program:

 

08:00

Registration

09:00

Opening and welcome

 

Plenary session:

9:20

Robot-assisted detection and sorting system for automatic, energy- and resource-efficient analysis and separation of electronic textiles for return to the product cycle of new smart textiles products

Alice Schwab
Textile Research Institute Thuringia-Vogtland e. V. (TITV e. V.)

 

Power over Data Lines for Automotive Ethernet

Fabian Barth
Texas Instruments Germany GmbH

 

Presentation of exhibitors / posters

10:45

Coffee break / Visit of the exhibition and poster session

 

Parallel sessions:

 

Session A1: Packaging and connection technology

Session B1: Embedded systems and industrial solutions

11:15

Hermetic sealing of metal hybrid assemblies

Stefan Dietl
Micro-Hybrid Electronic GmbH

European Cyber Resilience Act and its Impact on IEC 62443 and Embedded Industrial System Security

Karl Wachswender
Lattice Semiconductor GmbH

11:40

Particle formation and sinterability of Cu complex inks using different sintering

Nihesh Mohan
Ingolstadt University of Technology

Integration and Evaluation of different FPGA based Hardware Accelerators for the AES Algorithm in the TLS Protocol to be used in Critical Automation Systems

Luca Horn
OTH Regensburg

12:05

Condition prediction for LED solder joints using artificial intelligence

Andreas Zippelius
Ingolstadt University of Technology

Use of the digital twin for retrofit measures of automated production systems

Josef Fuchs Landshut University of Applied Sciences

12:30

Process control and material analysis of sintered and soldered joints using µ-Raman spectroscopy

Fabian Steinberger
Ingolstadt University of Applied Sciences

Enhancing Packet Routing for Self-Organized Microgrid (SDN-WSN) using ML-Aided Dijkstra with Cross-Platform Deployment

Prajwal Ramesh Ingenics Digital GmbH

12:55

Lunch break / Visit to the exhibition and poster session

 

Session A2: Sensor systems: development and application I

Session B2: Solutions in energy management

14:00

Silicon drift detectors for X-ray fluorescence analysis

Dr. Andreas Pahlke KETEK GmbH

SSPC - Solid-State-Power Contactors as semiconductor-based DC protection technology of the future

Maik Hohmann
Temes Engineering GmbH, Otterfing

14:25

Miniaturized hydrogen sensor based on the 3-omega method

Julian Eiler
OTH Regensburg

DC grids and DC protection concepts of the future

Fabian Benedikt Witt
Braunschweig University of Technology

14:50

Electron sources based on field emission from silicon

Philipp Buchner
OTH Regensburg

System Integration in E-Mobility Vehicles - Switch and Protect in High Voltage Systems

Dr. Stefan Müller
DRÄXLMAIER Group, Vilsbiburg

15:15

 

Comparative analysis of the efficiency of hybrid photovoltaic/solar thermal modules compared to conventional PV modules

Dr. Stefan-Alexander Arlt Landshut University of Applied Sciences

15:40

Coffee break / Visit to the trade exhibition and poster session

 

Session A3: Sensor systems: development and application II

Session B3: Components and systems for electric drives

16:30

Accelerated Real-Life Testing of Automotive LiDAR Sensors as Enabler for In-Field Condition Monitoring

Marcel Kettelgerdes
Ingolstadt University of Technology

Enhanced efficiency, reduce design complexity and increase driving range - The key role of Gate driver and microcontroller in a traction inverter system

Ralf Eckhardt, Michael Daimer
Texas Instruments EMEA Sales GmbH

16:55

Development of a camera with compressed air flow for use in dusty industrial environments

Dr. Norbert Babel Landshut University of Applied Sciences

Development of highly integrated power electronics

Dr. Fabian Denk
Compact Dynamics GmbH

17:20

Embedded sensor system with EtherCAT for determining indoor air quality

Maximilian Püschel
Rosenheim University of Applied Sciences

Complete system chain of an electric drive with axial flux machine

Dr. Alexander Kleimaier Landshut University of Applied Sciences

17:45

Evaluation of an acoustic method for recording surface vibrations

Dr. Artem Ivanov Landshut University of Applied Sciences

Packaging technology GaN power module with AMB substrate for a 3-level flying capacitor circuit at 800V DC

Janusz Wituski Landshut University of Applied Sciences

18:10

Conclusion / get together


Further information, conditions of participation and registration form can be found at www.symposium-esi.de.

Calendar of events

This calendar is subject to change. Please refer to the information and notes of the organizers on the respective websites!

Venue

Period

Event name

Organizer

Osaka, Japan

April 10 - 12, 2024

CICMT 2024

IMAPS, ACerS

Landshut

April 17, 2024

Symposium Electronics and System Integration (ESI)

HS Landshut

Toyama, Japan

April 17 - 20, 2024

ICEP 2024

JIEP, IEEE EPS

Tampere, Finland

June 11 - 13, 2024

Nordpak

IMAPS Nordic

Grenoble, France

June 19 / 20, 2024

MiNaPAD

IMAPS France

Edinburgh, Scotland

July 15 - 17, 2024

High Temperature Electronics Network, (HiTEN)

IMAPS UK

Berlin, Germany

September 11 - 13, 2024

Electronics System-Integration Technology Conference (ESTC)

IEEE, IMAPS

Boston, USA

Sept. 30 - Oct. 3, 2024

57th International Symposium on Microelectronics

IMAPS USA

Munich, Germany

October 17 - 18, 2024

Fall Conference

IMAPS DE

IMAPS Germany - Your association for packaging and packaging technology

IMAPS Germany, part of the 'International Microelectronics and Packaging Society' (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

  • we connect science and practice
  • we ensure the exchange of information among our members and
  • we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM), This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)

  • Issue: Januar
  • Year: 2020
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Eugen G. Leuze Verlag GmbH & Co. KG
Karlstraße 4
88348 Bad Saulgau
GERMANY

Phone.: +49 7581 4801-0
Fax: +49 7581 4801-10
EMail: info@leuze-verlag.de

 

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