Following the successful IMAPS Germany Spring Seminar in Ingolstadt at the end of February, we are looking ahead to other highly interesting events that await us as a microelectronics and packaging community. The 20th Device Packaging Conference (DPC) and the Workshop on Advanced Packaging for Medical Microelectronics are taking place in Fountain Hills at the same time as this issue is being published. At the DPC, the three conference days are filled with keynote speeches and parallel sessions on Heterogeneous 2D & 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip and Next Gen Applications. The program is rounded off by 12 Professional Development Courses and discussions on current topics. For example, an entire morning will be dedicated to the effects of the geopolitical situation, with the corresponding session "Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem - Opportunities & Challenges".
Invitation to the Electronics and System Integration Symposium
On 17 April 2024, the 4th Electronics and System Integration Symposium (ESI 2024), organized by the Microsystems Technology Cluster at Landshut University of Applied Sciences and supported by IMAPS Germany, will take place in Landshut. The symposium program offers a total of 25 lectures, which will be presented in the plenary and in two parallel sessions. The spectrum of contributions ranges from issues in assembly and connection technology to innovative sensor concepts and solutions for energy management and the electric drives of the future. All participants at the event will also have access to the digital conference proceedings with scientific papers.
In addition to the presentations, the parallel trade exhibition is also an essential part of the symposium. This platform offers the specialist audience an ideal opportunity to find out about the latest technologies, new research findings and innovative products and services.
Companies, start-ups, scientific staff, graduates and students can present innovative products, new developments and the results of research and development projects in a poster session. The registration deadline for the poster session is March 29, 2024.
Here is an overview of the event program:
08:00 |
Registration |
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09:00 |
Opening and welcome |
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Plenary session: |
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9:20 |
Robot-assisted detection and sorting system for automatic, energy- and resource-efficient analysis and separation of electronic textiles for return to the product cycle of new smart textiles products Alice Schwab |
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Power over Data Lines for Automotive Ethernet Fabian Barth |
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Presentation of exhibitors / posters |
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10:45 |
Coffee break / Visit of the exhibition and poster session |
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Parallel sessions: |
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Session A1: Packaging and connection technology |
Session B1: Embedded systems and industrial solutions |
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11:15 |
Hermetic sealing of metal hybrid assemblies Stefan Dietl |
European Cyber Resilience Act and its Impact on IEC 62443 and Embedded Industrial System Security Karl Wachswender |
11:40 |
Particle formation and sinterability of Cu complex inks using different sintering Nihesh Mohan |
Integration and Evaluation of different FPGA based Hardware Accelerators for the AES Algorithm in the TLS Protocol to be used in Critical Automation Systems Luca Horn |
12:05 |
Condition prediction for LED solder joints using artificial intelligence Andreas Zippelius |
Use of the digital twin for retrofit measures of automated production systems Josef Fuchs Landshut University of Applied Sciences |
12:30 |
Process control and material analysis of sintered and soldered joints using µ-Raman spectroscopy Fabian Steinberger |
Enhancing Packet Routing for Self-Organized Microgrid (SDN-WSN) using ML-Aided Dijkstra with Cross-Platform Deployment Prajwal Ramesh Ingenics Digital GmbH |
12:55 |
Lunch break / Visit to the exhibition and poster session |
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Session A2: Sensor systems: development and application I |
Session B2: Solutions in energy management |
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14:00 |
Silicon drift detectors for X-ray fluorescence analysis Dr. Andreas Pahlke KETEK GmbH |
SSPC - Solid-State-Power Contactors as semiconductor-based DC protection technology of the future Maik Hohmann |
14:25 |
Miniaturized hydrogen sensor based on the 3-omega method Julian Eiler |
DC grids and DC protection concepts of the future Fabian Benedikt Witt |
14:50 |
Electron sources based on field emission from silicon Philipp Buchner |
System Integration in E-Mobility Vehicles - Switch and Protect in High Voltage Systems Dr. Stefan Müller |
15:15 |
Comparative analysis of the efficiency of hybrid photovoltaic/solar thermal modules compared to conventional PV modules Dr. Stefan-Alexander Arlt Landshut University of Applied Sciences |
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15:40 |
Coffee break / Visit to the trade exhibition and poster session |
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Session A3: Sensor systems: development and application II |
Session B3: Components and systems for electric drives |
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16:30 |
Accelerated Real-Life Testing of Automotive LiDAR Sensors as Enabler for In-Field Condition Monitoring Marcel Kettelgerdes |
Enhanced efficiency, reduce design complexity and increase driving range - The key role of Gate driver and microcontroller in a traction inverter system Ralf Eckhardt, Michael Daimer |
16:55 |
Development of a camera with compressed air flow for use in dusty industrial environments Dr. Norbert Babel Landshut University of Applied Sciences |
Development of highly integrated power electronics Dr. Fabian Denk |
17:20 |
Embedded sensor system with EtherCAT for determining indoor air quality Maximilian Püschel |
Complete system chain of an electric drive with axial flux machine Dr. Alexander Kleimaier Landshut University of Applied Sciences |
17:45 |
Evaluation of an acoustic method for recording surface vibrations Dr. Artem Ivanov Landshut University of Applied Sciences |
Packaging technology GaN power module with AMB substrate for a 3-level flying capacitor circuit at 800V DC Janusz Wituski Landshut University of Applied Sciences |
18:10 |
Conclusion / get together |
Further information, conditions of participation and registration form can be found at www.symposium-esi.de.
Calendar of events
Venue |
Period |
Event name |
Organizer |
Osaka, Japan |
April 10 - 12, 2024 |
CICMT 2024 |
IMAPS, ACerS |
Landshut |
April 17, 2024 |
Symposium Electronics and System Integration (ESI) |
HS Landshut |
Toyama, Japan |
April 17 - 20, 2024 |
ICEP 2024 |
JIEP, IEEE EPS |
Tampere, Finland |
June 11 - 13, 2024 |
Nordpak |
IMAPS Nordic |
Grenoble, France |
June 19 / 20, 2024 |
MiNaPAD |
IMAPS France |
Edinburgh, Scotland |
July 15 - 17, 2024 |
High Temperature Electronics Network, (HiTEN) |
IMAPS UK |
Berlin, Germany |
September 11 - 13, 2024 |
Electronics System-Integration Technology Conference (ESTC) |
IEEE, IMAPS |
Boston, USA |
Sept. 30 - Oct. 3, 2024 |
57th International Symposium on Microelectronics |
IMAPS USA |
Munich, Germany |
October 17 - 18, 2024 |
Fall Conference |
IMAPS DE |
IMAPS Germany - Your association for packaging and packaging technology
IMAPS Germany, part of the 'International Microelectronics and Packaging Society' (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:
- we connect science and practice
- we ensure the exchange of information among our members and
- we represent the point of view of our members in international committees.
Imprint
IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit
1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar,
You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)