iMaps News 01/2024

Dear IMAPS members,

An eventful year lies behind us and I would like to use the start of the year to turn to you - to you, who have always remained loyal to us and filled the association with life. It is very pleasing that IMAPS Germany is still by far the strongest chapter in Europe despite the turbulent past few years. Over 240 members is a proud figure, but we must continue to work to keep it that way or even increase the number of members again. Since 2015 (the last time the German chapter hosted the EMPC in Friedrichshafen), we have also seen a slight but relatively steady decline in membership. In order to offer our members added value, we have repeatedly tried to create opportunities for knowledge acquisition and networking over the past year to keep you up to date in the field of advanced packaging. Let us now look back together at the year 2023 and then look ahead to the events that await us in the new year.

Events 2023

The 2023 event year began with the IMAPS spring seminar on March 23 at TU Ilmenau. Under the motto "Is electronics for sustainability really sustainable? (production aspects, materials, design, application)", the event attracted over 50 participants. Just a few weeks later, the "IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies" (CICMT 2023) took place in Albuquerque from April 18 to 20, focusing on ceramic technologies for microsystems and interconnection technologies. A highlight for all IMAPS members was certainly the "24th European Microelectronics & Packaging Conference" (EMPC 2023) in Hinxton, organized by IMAPS UK: With 5 keynotes, 4 short courses, 69 presentations in 20 sessions and 18 posters, EMPC 2023 offered an exciting and varied program for over 260 delegates from all over the world from 11 to 14 September.

In addition to the IMAPS Spring Seminar mentioned above, we can look back on a very successful IMAPS Autumn Conference, which took place on October 19 and 20, 2023 at the Munich University of Applied Sciences. In 20 presentations, new findings from all areas of assembly and joining technology were presented, from sintering, LTCC and reliability to new materials and processes. During the breaks, the stands of the eleven exhibitors proved to be extremely popular points of contact for the almost 100 participants. I would like to take this opportunity to thank our five sponsors - AEMTec, Budatec, EKRA, Hesse and Indium.

In addition to the events mentioned, IMAPS was also active as a supporter of the 56th International Symposium on Microelectronics in San Diego (October 2-5, 2023) and the Advanced Packaging Conference at SEMICON EUROPA in Munich (November 14-17, 2023). You can find reviews of some of these events on our website www.imaps.de,die to keep you up to date with all our activities.

What's coming up in the new year?

The IMAPS spring seminar on February 20 will kick off the 2024 event program. New insights into the topic of "Electronics for the car of tomorrow" will be offered at the Ingolstadt University of Applied Sciences. You can expect presentations from Conti, Bosch, Infineon and Texas Instruments, among others. Shortly afterwards, you can look forward to the 12th GMM/DVS symposium at EBL 2024 in Fellbach (05./06.03.2024), which will be dedicated to the topic of "Sustainability and energy efficiency with smart electronics" and in which IMAPS Germany will participate as a partner and supporter as usual.

I would also like to draw your attention to our sister event, the "IEEE Electronics System-Integration Technology Conference" (IEEE ESTC 2024), which always takes place alternately with the EMPC in the fall, this year from September 11-13 in Berlin. The call for papers is still open until March 1 and I would be delighted to meet many of you at ESTC in September 2024 as speakers or exhibitors. We at IMAPS Germany are also involved here and are keeping our fingers crossed for the organizers around my IZM colleague Dr. Tanja Braun.

As usual, you can of course count on the IMAPS Autumn Conference taking place in Munich in October, on October 17/18, 2024. Details of the event will be announced on our website as they become available. Other event highlights in the new year are the CICMT 2024 in Osaka (10-12.04.2024) and the "^57th International Symposium on Microelectronics" in Boston (01-03.10.2024).

Finally, I would like to thank all members of the association for their cooperation over the past year. Your support in the form of specialist presentations, participation in exhibitions and sponsorship ensures that IMAPS Germany remains extremely attractive as an association.

The entire extended Executive Board wishes you and your families a healthy and successful 2024. Stay with us!

Yours sincerely,
Yours
Martin Schneider-Ramelow

Save the Date: Symposium ESI 2024 on April 17 in Landshut offers the latest findings on electronics

From global challenges such as the generation of renewable energy or the switch to e-mobility to modern applications of medical technology and digitalization: electronics and electrical engineering form the basis for all these developments. For 15 years now, Landshut University of Applied Sciences has been offering a platform for the exchange of ideas between industry and research in the forward-looking field of electronics/electrical engineering and microsystems technology with its symposia. The "4th Symposium on Electronics and System Integration (ESI)" will once again present the latest findings and developments on April 17, 2024.

In two plenary lectures and 24 lectures in two parallel sessions, experts will present innovative solutions, research findings and services to a specialist audience. The topics of the sessions are:

• Packaging and connection technology,
• Sensor systems: development and application,
• Embedded systems and industrial solutions,
• Solutions in energy management,
• Components and systems for electric drives.

The program of the ESI 2024 symposium and further information can be found at www.symposium-esi.de.

Calendar of events

IMAPS Germany - Your association for packaging and packaging technology

IMAPS Germany, part of the International Microelectronics and Packaging Society (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM), This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)