The 13th International MID Congress 2018 will take place in Würzburg from September 25 to 26. The congress, organized every two years by the Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e. V., is the world's leading event on MID technology. It aims to provide a platform for the current state of the art and for the exchange of knowledge and experience on spatially integrated mechatronic components. New manufacturing processes and new materials are the thematic focus of the event. It aims to promote understanding of applications ranging from molded interconnect devices to mechatronic integrated devices.
A product exhibition will round off the congress. The MID Advancement Award and the Best Paper Award will also be presented again. A tour of an industrial company from the MID sector is planned for September 26, 2018. As in 2016, the contributions to the Scientific Track will also be published in an IEEE conference volume this year.
