ASMPT has added two new features to its DEK printing platforms that automate solder paste transfer and simplify squeegee changes.
When changing stencils in the printer, the solder paste remaining on the stencil to be removed must be transferred to the new stencil, which was previously done manually using a spatula. This manual process often failed to capture the entire remaining quantity.
The new paste transfer unit for the DEK TQ now simplifies and automates this process: the paste is transferred fully automatically each time the stencil is changed. To do this, it is pushed onto a transfer unit with the squeegee and from there applied to the new stencil again with the squeegee. The system then automatically cleans itself of paste residue using the underside cleaning system. This process is faster, more precise and more economical than would be possible by hand.
Transfer unit automates solder paste transfer when changing stencils (Image: ASMPT)
According to the manufacturer, the new paste transfer system can be retrofitted to all solder paste printers on the DEK TQ platform with little effort. ASMPT has also optimized the squeegee change. Previously, the squeegee was attached with two wing screws. However, this seemingly simple procedure for changing the squeegee can become a problem if a strong employee tightens the wing screws and a less strong employee later tries to loosen them again. A new holder will make the change much easier. The squeegee is automatically unlocked when it is removed from the machine. It can then be replaced with a single movement, before the holder is automatically locked when the machine is retracted. This reduces the changeover time by up to 50 percent. Mechanical coding prevents the doctor blade from being inserted incorrectly. The new doctor blade holder can be retrofitted in just a few hours and is available for both the DEK TQ and the NeoHorizon platform.
