Dwarf with maximum performance: module for headless servers

Dwarf with maximum performance: module for headless servers

Kontron introduces the new COM Express Basic Type 7 Computer-on-Module based on AMD EPYC Embedded 3000 SoC processors. It offers cost-efficient, highly scalable server-class performance in a small form factor. Measuring just 125 x 95 mm and designed for use on a carrier board, the module is suitable for a wide range of headless high-performance server applications - i.e. for applications where no display is required. These include embedded edge and micro servers, medical imaging, 5G, AI, machine learning/camera inspection and test & measurement.

The module can be equipped with 4 to 16 cores and enables outstanding memory capacity with up to 4 x SODIMM sockets, which can be equipped with 128GB DDR4 RAM. The network capabilities and connectivity required for demanding applications are provided with 4 x 10GbE interfaces and up to 32 PCIe Gen 3 lanes. Furthermore, an optional onboard NVMe can be integrated in addition to the 2x SATA ports.

The module is industrial-grade and suitable for operation in harsh environments from -40 °C to 85 °C. It includes 4x USB 3.1, 4x USB 2.0 as well as LPC, SPI Flash, SMB, Dual Staged Watchdog and RTC. Another feature is a Trusted Platform Module (TPM 2.0) for maximum security. A COM Express Eval carrier board type 7 is also available.

  • Issue: Januar
  • Year: 2020
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Eugen G. Leuze Verlag GmbH & Co. KG
Karlstraße 4
88348 Bad Saulgau

Tel.: 07581 4801-0
Fax: 07581 4801-10
E-Mail: info@leuze-verlag.de

 

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