Canadian supplier AIM Solder launches its new LUX product line: Solder materials designed to provide LED, MiniLED and high power LED assembly manufacturers with solder pastes and alloys that solve production challenges associated with these applications.
The product line combines ultra-fine SAC-based and silver-free alloy powders of types 6, 7 and 8 with innovative flux chemistry. In combination with the SN100C alloy, the NC259 solder pastes eliminate silver migration issues. AIM REL61 is a low-silver alloy option that can lower reflow peak temperature requirements and improve mechanical strength compared to other low-silver or silver-free alloys. For high-power LEDs, REL22 doubles the lifetime under extreme thermal cycling conditions. AIM's Tacky Flux offers high adhesion forces, long processing time and improved wetting for all mass transfer and high-speed dipping applications.
