Super-fast thin-film chip fuse for e-mobility

Super-fast thin-film chip fuse for e-mobility

Vishay Intertechnology presents a new thin-film chip fuse with super-fast characteristics that is specially designed for e-mobility applications. It is AEC-Q200 qualified and available with rated currents from 0.5 A to 5.0 A.

The new component is used in electric (EV) and hybrid electric (HEV) vehicles, where it protects voltage monitoring circuits in battery management systems as well as circuits in the small signal range. The strictly controlled thin-film manufacturing process ensures excellent stability of the fuse properties.

The chip fuse has a robust design consisting of a homogeneous metal alloy layer on a high-quality ceramic substrate. Its fuse elements are coated with a protective lacquer that protects against electrical, mechanical and climatic influences. Other special features of the component include excellent sulphur resistance in accordance with ASTM B 809, it passes the 85 °C / 85 % r.h. test over 1000 h under load and is also tested for thermal shock resistance.

The component is available in size 0603, is designed for voltages up to 63 V, breakdown currents up to 50 A and for an operating temperature range of -55 °C to +125 °C. Processing in automatic SMD assembly and automatic wave, reflow and vapor phase soldering processes is possible.

  • Issue: Januar
  • Year: 2020
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Eugen G. Leuze Verlag GmbH & Co. KG
Karlstraße 4
88348 Bad Saulgau

Tel.: 07581 4801-0
Fax: 07581 4801-10
E-Mail: info@leuze-verlag.de

 

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