To make micro-electromechanical systems (MEMS) even more powerful in the future, researchers at the Fraunhofer Institute for Laser Technology ILT in Aachen have developed a CMOS-compatible coating and laser crystallization process in collaboration with Fraunhofer ISIT and IST. In contrast to conventional methods, this process eliminates wires and solder joints, which can significantly reduce component size and increase sensor performance.
As an alternative to conventional joining techniques, the Fraunhofer ILT relies on a laser-based process that enables MEMS sensors made of crystalline silicon to be built directly (monolithically) on the temperature-sensitive circuits. High-temperature crystallization by means of laser radiation below the melting point of silicon takes place selectively and very quickly, so that the underlying circuit is not damaged. Interesting applications for the new process are emerging in the automotive industry, medical technology and the fire department.
