The 9th Electronics System-Integration Technology Conference (ESTC 2022) will take place in less than a month in Sibiu, Romania. It is the largest semiconductor packaging conference in Europe and an international event in the field of electronics packaging and system integration. The conference is organized every two years and is the flagship event of IEEE EPS (Electronics Packaging Society of IEEE) in Europe. It is supported by IEEE EPS in cooperation with IMAPS Europe and a group of three local organizers: University Politehnica Bucharest (UPB), Technical University of Cluj-Napoca and Academy of Land Forces "Nicolae Balcescu" in Sibiu. Registration for the fair is now open.
With around 90 presentations in more than 20 technical sessions, in addition to around 40 interactive presentations (plenary and interactive poster sessions), 10 keynote speeches, 6 workshops, 4 professional development courses (PDCs), more than 30 exhibitors (who will also present themselves to the industry in plenary speeches) and a company visit to the main sponsor of ESTC 2022, Continental Automotive Romania, the organizers aim to attract more than 300 participants along the microelectronics and system integration supply chain from industry, research and technology organizations and local universities.
This year's focus areas are: Advanced packaging, interconnect and packaging materials; reliability of electronic devices and systems; packaging of power electronics systems, packaging of optoelectronic systems; assembly and manufacturing technologies; packaging of RF, mm-wave and TH systems; flexible, printed and hybrid electronics; advanced technologies for emerging systems; design tools and modeling; packaging of biomedical applications; global education for electronics.
The 9th ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC 2022) will take place in-person in Sibiu, Romania, in less than a month. ESTC is the single largest semiconductor packaging conference in Europe and a premier international event in the field of electronics packaging and system integration. The conference is organized every two years and is the IEEE EPS (Electronics Packaging Society of IEEE) flagship conference in Europe supported by IEEE EPS in association with IMAPS Europe, and a group of three local organizers: University Politehnica of Bucharest (UPB), Technical University of Cluj-Napoca, and Land Forces Academy "Nicolae Balcescu" of Sibiu. The registration is open.
With around 90 oral presentations in more than 20 technical sessions, around 40 interactive presentations (plenary and interactive poster sessions), 10 keynotes, 6 workshops, 4 Professional Development Courses (PDCs), more than 30 exhibitors (presenting themselves additionally in plenary industry pitches), and a company visit to ESTC 2022's main sponsor, Continental Automotive Romania, the organizers target to attract more than 300 on-site participants along the supply chain for microelectronics and system integration from industry, research and technology organizations, and academics.
This year's focus areas are: Advanced Packaging, Materials for Interconnects and Packaging; Reliability of Electronic Devices and Systems; Power Electronics System Packaging, Optoelectronic System Packaging; Assembly and Manufacturing Technologies; RF, mm-wave, and TH Systems Packaging; Flexible, Printed and Hybrid Electronics; Advanced Technologies for Emerging Systems; Design Tools and Modeling; Biomedical Application Packaging; Global Education for Electronics.
Please register online at: https://www.estc-conference.net/estc-2022/registration
Website: www.estc-conference.net/estc-2022
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