As a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors, Infineon Technologies and the Dutch-American automotive manufacturer Stellantis N.V. have signed a non-binding Memorandum of Understanding. Under the agreement, Infineon would reserve manufacturing capacity and supply CoolSiC bare die chips to Stellantis' direct Tier 1 suppliers in the second half of the decade. The procurement volume and capacity reservation is worth more than €1 billion.
Peter Schiefer, Division President Automotive at Infineon"We are pleased to develop partnerships with leading automotive companies such as Stellantis," said Peter Schiefer, Division President Automotive at Infineon. "Compared to conventional drive technologies, silicon carbide increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC technology and continued investment in our manufacturing capabilities, we are well positioned to meet the growing demand for power electronics for e-mobility."
Infineon and Stellantis are in discussions to supply CoolSiC Gen2p 1200V and Gen2p 750V chips under the Stellantis brands. This would enable Stellantis to build vehicles with longer range and lower fuel consumption and would support its efforts to standardize, simplify and modernize platforms. Infineon is preparing for rising demand with significant investments. A new factory for SiC technologies in Kulim, Malaysia, will start production in 2024. Infineon's multi-site manufacturing strategy will complement the existing capacity in Villach, Austria.
