Swedish Inspectis AB (Solna, S) presents a new BGA inspection system featuring an extremely small optical probe with built-in high-power illumination and a 90° viewing angle.
The system generates high-resolution images of the extremely low-light areas under BGAs, μBGAs, CSP, CGA and FlipChip packages with a distance of only 40 µ, so that microcracks, cold solder joints, whiskers, missing balls, scaling, excess flux and other soldering problems from the field of SMT assembly production and BGA processing can be detected. The optics can be variably focused and, in conjunction with the flexible, electronically dimmable glass fiber brush light as a backlight, enables the user to precisely image BGA solder bumps from the 1st to the 20th row.
