Infineon Technologies AG is launching a new IGBT power module for drive converters in electric vehicles in the 80 to 100 kW power class: the HybridPACK DC6i with an optimum ratio of system costs and performance. It combines EDT2 IGBTs from Infineon with packages that enable compact design, very good thermal management at low material costs and easy assembly. When selecting a power module, the optimum silicon area for the given requirements is decisive. The module joins the HybridPACK1 and the more powerful HybridPACK Drive family in the Infineon portfolio.
The new module has the same compact footprint (7.2 x 14 cm) as the HybridPACK1, making it 25 % smaller than the HybridPACK Drive - with more than 50 % higher output power. While the HybridPACK1 uses IGBT3 technology, the DC6i is equipped with the newer EDT2 IGBTs. Furthermore, the new module has six screw connectors to the DC link capacitor, whereas the HybridPACK1 family only has two. This enables a low-inductance design with a leakage inductance of 15 nH. Infineon's patented, directly cooled wave baseplate offers very good heat dissipation, with thermal resistance from the IGBT chip junction to the liquid of 0.17 K/W.
The HybridPACK DC6i also enables efficient and automated high-volume production: press-fit pins and additional guides allow the gate driver board to be assembled in just a few seconds compared to conventional selective soldering in more than a minute. The new module is qualified according to the AQG324 standard for automotive power modules.
Infineon's EDT2 technology is a micro-trench technology optimized for electric powertrain applications. It offers a reverse voltage of 750 V, an extended operating temperature of 175 °C for short periods and high short-circuit resistance. Switching and conduction losses are optimized for a real driving cycle with excellent light load power losses, resulting in an efficiency increase of 20 % compared to Infineon's previous IGBT3 generation. HybridPACK DC6i is available from distributors since September 2020.
