The 'SMTconnect' forum will feature presentations by experts from industry and science on the topics of production in power electronics, AI in electronics production and Industry 4.0. Aspects such as improving power density, increasing efficiency and extending the service life of electronic components will be discussed. Insights will be provided by Nils Thielen, Director of the Electronics Production Research Sector at the FAPS Institute at the University of Erlangen-Nuremberg, with a keynote speech on 'Trends from a research perspective' and Dr. Markus Meier, Zestron, with a presentation on 'HAST quality testing of epoxy mold compounds based on iodine vapor testing and impedance spectroscopy'. Further presentations will be given by Dr. Sandra Engle, VDMA Productronic Department, and Volker Pape, Member of the VDMA Executive Board, on 'VDMA Productronic Network Activities for Mechanical Engineering in the Semiconductor Value Chain' and Olesja Kopp, Product and Innovation Manager at Viscom, on 'The Next Level of Effective Inspection Processes'.
June 11, 11:30 a.m. - 12:30 p.m.
Network activities VDMA Productronic for mechanical engineering in the semiconductor value chain (Speakers: Dr. Sandra Engle, Volker Pape)
Location: FORUM, Hall 4, Stand 115
June 11, 3:00 p.m. - 3:30 p.m.
The next level of effective inspection processes (Speaker: Olesja Kopp)
Location: FORUM, Hall 4, Stand 115
June 12, 10:05 a.m. - 10:35 a.m.
Keynote: Innovative packaging technology in power electronics - insight into research (Speaker: Nils Thielen)
Location: FORUM, Hall 4, Stand 115
June 12, 11:15 am - 11:35 am
HAST Quality testing of epoxy mold compounds based on iodine vapor testing and impedance spectroscopy (Speaker: Dr. Markus Maier)
Location: FORUM, Hall 4, Stand 115
dir/Gustl Keller
Forum program of the 'PCIM Europe
PCIM Europe also offers a rich program of presentations on all three days of the fair. We have made a note of the following sessions, which promise exciting presentations and discussions.
June 11, 09:45 - 10:30
Rolf Hellinger (Siemens) and Leo Lorenz (ECPE - European Center for Power Electronics) will talk about the influence of AI on the entire life cycle of power electronics. The current status of the development of cognitive AI, which attempts to emulate human-like cognitive functions such as learning and problem solving, will be discussed, as well as how companies can use this technology and what responsibilities this entails.
Venue: NCC Mitte, Room Brussels 1
June 12, 13:00 - 14:30
Seven short presentations on SiC devices will arouse interest. The session will be moderated by Thomas Neyer (Infineon). Among others, Emanuela Alfonzetti (STMicroelectronics) will talk about RC-DC snubber circuits for suppressing diode voltage spikes and ringing in SiC half-bridge power modules.
Location: Stage Hall 10.1
June 13, 9:50 am - 11:10 am
The presentation session 'WBG Reliability' on wide bandgap semiconductors (WBG) promises interesting insights. Among other things, the use of silicon carbide in power devices for aircraft and spacecraft will be discussed. Prof. Dr.-Ing. Nando Kaminski (University of Bremen) will be the moderator.
Location: Hall Munich 1
Markolf Hoffmann
Selection of exhibiting companies
Alpha-Numerics
As a provider of electronics cooling, Alpha-Numerics ensures that electronics do not overheat and work reliably. The company offers component cooling within a device or air conditioning for an entire server room, as well as suitable software tools that can be used to reliably simulate heat development. Knowledge about the use of CFD applications is shared with customers in workshops and training courses, and simulations or modeling are carried out for customers if the purchase of a license is not profitable. The possibilities of temperature simulation and order simulation will also be presented at the Constellium stand this year.
dir/Gustl Keller
www.constellium.com
PCIM Europe, Hall 9, Stand 438
Picture: AMSYS
AMSYS
The company AMSYS Drucktechnik presents new sustainable sensors, such as the energy-saving pressure sensor 125Pa up to 2 bar - AMS 5935. In contrast to conventional 'wearables', which have high energy requirements and require frequent recharging, the sensor has an integrated I2C / SPI interface that outputs calibrated pressure and temperature readings and has a low power consumption.
dir/Kristina Altvater
www.amsys.de
Sensor + Test, Hall 1, Stand 1-340
Asahi Kasei Microdevices Europe
Asahi Kasei Microdevices (AKM), offers a variety of sensor devices based on compound semiconductor technology and IC products with analog/digital mixed-signal technology. This year, AKM will present current sensor solutions compatible with SiC/GaN power devices and eFuse systems with current sensors.
dir/Kristina Altvater
https://www.akm.com/eu/en/
PCIM Europe, Hall 7, Stand 502
SERIO 6000 printer from EKRA; Image: ASYS
ASYS Group
As a provider of manufacturing solutions for the electronics, energy and life science industries, the ASYS Group will be presenting a wide range of high-tech solutions under the motto 'Automate, digitalize & connect'. From scalable assembly solutions to intelligent management systems, the company offers products for efficient and future-proof production. ASYS also focuses on sustainability and adaptability. Its scalable platforms offer turnkey solutions for every requirement, while software solutions can smartly control and manage the entire factory. The Final Assembly platform, the Smart Factory Manager Pulse PRO, the VEGO handling systems in combination with the Insignum laser marking system, the Hycon XH4 MultiLane printer and the SERIO 6000 printer from subsidiary EKRA will be on display at the trade fair. ASYS will also be presenting its portfolio of material logistics solutions, including magazine and reel handling with intelligent software and autonomous material handling.
Gustel Keller
www.asys-group.com
SMTconnect, Hall 4A, Stand 345
Balver Zinn: Core competence is wave soldering
Balver Zinn Josef Jost GmbH & Co KG from Balve in the Sauerland region of Germany supplies solder in a wide variety of forms and alloys as well as fluxes for lead-free and leaded soldering processes. The wide range of fluxes are used not only in wave soldering systems but also in solder wires and solder pastes. The modern REGI series in particular, with its different VOC content, has been attracting attention since its market launch. As a pioneer of lead-free conversion, the application engineers at Balver Zinn can look back on many years of experience. With the help of process knowledge, additives for the solder, or the brand new high-runner flux REGI-RED® are gladly used tools to optimize the process. Advancing miniaturization, increasing application temperatures of electronic assemblies and the packing density of devices present new challenges for assembly manufacturers. Solder manufacturers must provide support with reliable, cost-effective and sustainable solutions. Previous standards, such as SAC305 or other alloys, are gradually being questioned or replaced by more modern systems. The alloy SN100CV® is one of these modern systems. SN100CV® is available both as solder paste with JEAN-151® and as solder wire with e.g. StarCore® and is compatible with the latest REGI flux series. StarCore® solder wire is for repair and standard applications. The StarCore® variant of the standard solder wires has a specifically shaped flux core to minimize the internal vapour pressure due to the melting resins and boiling solvents. This leads to a reduction in the number and size of flux spatter. The StarCore® has been specially developed for lead-free repair and re-soldering.
Text: Balver Zinn
www.balverzin.com
SMTConnect, Hall 4, Stand 344
budatec
The machine manufacturer for the semiconductor and solar industry, budatec, is represented with its vacuum soldering systems (small, medium and large series machines through to fully automatic production systems) and sintering systems (small devices that can be integrated into our vacuum soldering systems and large production systems).
you/Kristina Altvater
https://budatec.de/PCIM
Europe, Hall 5, Stand 402
cts GmbH: Modular storage system now also processes KLT boxes and tray stacks
The intralogistics and automation specialist cts GmbH is expanding the functional scope of its successful Smart In-Production Warehouse for the electronics and automotive industries: both the Smart Warehouse and the smaller Mini Smart Warehouse version can now mix and automatically store and retrieve KLT boxes and tray stacks from various manufacturers in addition to PCB magazines. Intelligent and space-saving storage systems from cts have been successfully used for PCBs across all industries since 2020. Fully automated on request, both PCB magazines and standardized small load carriers, so-called KLT boxes, as well as tray stacks can now be temporarily stored in a mixed manner - either in the same area or in an additional, separate area in the warehouse, but always in a space-saving and efficient manner close to the production lines. Mixed storage has many advantages for the customer. In addition to the PCBs, consumables such as solder paste or cleaning fluid can now also be stored in a space-saving manner and integrated into the fully automated intralogistics system. Both the PCB magazines and the KLT boxes can be tracked precisely - an important basis for seamless material flow monitoring, for example by an ERP system or in the SAP world."
"cts - more than automation"
Founded in 2006, cts GmbH, Burgkirchen, offers customers a complete range of services for process and production automation. More than 350 employees develop innovative solutions at several locations in Europe, Singapore and, in future, the USA. The comprehensive range of services offered by the established system integrator from southern Bavaria includes feasibility studies, conceptual design, planning, implementation, maintenance and servicing of running systems and plants. You can find out more information when you visit our stand at SMTconnect in Nuremberg in Hall 4, Stand 213.
Text: cts GmbH
www.group-cts.de
SMTConnect, Hall 4, Stand 213
Picture: AMA Service GmbH
Evolution Measurement Ltd. at Sensor + Test 2024
The Evolution Measurement team manufacture the EvoScann range of miniature pressure scanners and have expertise in aerodynamic testing, particularly in the automotive industry. They offer solutions for multi-point pressure and temperature measurements, the development of automated calibration and test systems and measurement solutions. For industries such as aerospace, motorsport, power generation, universities and research institutions, Evolution Measurement will present the new Streamwise ProCAP 3D flow visualization system and the new Scanivalve DSA5000 pressure scanner at 'Sensor + Test' 2024.
Kristina Altvater
www.evolutionmeasurement.com
Sensor + Test, Hall 1, Stand 1-167
Kiel University of Applied Sciences
At Kiel University of Applied Sciences, prospective students can choose from 40 accredited degree programs from the six faculties of Agricultural Economics, Computer Science and Electrical Engineering, Mechanical Engineering, Media, Social Work and Health and Business. A team of students and staff present themselves and their university of applied sciences.
dir/Kristina Altvater
www.fh-kiel.de/startseite/
PCIM Europe, Hall 6, Stand 106
FRITSCH: Everything for SMT from a single source!
Fritsch systems are ideal for the construction of high-quality prototypes and small to medium-sized series. They are used in development, at universities and in research, as well as by newcomers to SMT production. The core segments of Fritsch GmbH are adaptive, highly flexible SMT solutions and sophisticated dispensing systems, which are suitable for a wide variety of applications such as jetting solder pastes, adhesives, insulating and filling materials, activators, lacquers, etc. The fully and semi-automatic machines are equipped with sophisticated software packages that are optimized for the daily needs of production. The high level of intuitive user-friendliness is also unique.
In addition, our well-trained service team supports customers on site, by telephone or via online support. For customer-specific special solutions, our creative developers are on hand to help you implement your production process.
At Fritsch GmbH, we have been dealing with machines for placement and assembly since the company was founded over 45 years ago. As a medium-sized family business, we are in close personal contact with our customers. We have constantly expanded our product portfolio in response to their wishes and needs. Today, from our company site in Amberg, we offer machines and systems that are suitable for both electronic and mechanical applications, and we are continuously developing and expanding our product range and range of services. By taking over the technical know-how of two renowned German manufacturers of soldering systems, the high-performance soldering systems IRO850 and MRO250 are now also produced at Fritsch and further developed for the future. A successful rounding off of the existing product portfolio. At the SMTconnect in Nuremberg you will find us in hall A4 booth 155.
Text: Fritsch GmbH
www.fritsch-smt.de
SMTConnect, Hall A4, Stand 155
BAMFIT tester; Image: F&S Bondtech
F&S BONDTEC at PCIM for the first time
The mechanical engineering company F&S Bondtec from the semiconductor technology sector will be exhibiting its wire bonding and test machines, which are used in sensor technology, medical technology and e-mobility, at 'PCIM Europe' 2024 for the first time this year. The team will be presenting itself at the trade fair with the topic of battery bonding and the product groups load cycle testing, wire bonding and equipment for destructive and non-destructive testing.
dir/Kristina Altvater
www.fsbondtec.at/
PCIM Europe, Hall 5, Stand 203
Göpel electronic
The company will be providing information on developments in quality assurance and how systems for THT and SMT production can be flexibly adapted to individual production conditions. The THT Line 3D AOI system offers a solution for the inspection of THT components and soldered connections as well as wave-soldered SMDs. Below the conveyor belt, a 3D camera module performs a 3D inspection of the THT solder joints and pins simultaneously, independently and without turning. The system is presented with telecentric optics for optimum image quality with changing assemblies and workpiece carriers. In addition, the Reflex Reducer enables the measurement
of critical solder connections and pins, the detection of which was previously only possible to a limited extent or not at all.
The MultiEyeS plus automatic optical inspection module has been expanded to include augmented reality-based placement assistance. A laser projector integrated into the AOI module enables the user-guided assistance function by displaying placement information, such as the position or component, directly in the operator's field of vision. The Vario Line 3D X300 has been equipped with a new 3D camera module. The AOI system enables the measurement of components up to a height of 35 mm and the inspection of optically critical surfaces with a large dynamic range. The AOI system software Pilot AOI Version 7 offers new functions in terms of performance and user-friendliness. Gerber data can be automatically generated from a bare board. This helps small and medium-sized service companies that do not have such data. The MagicClick function can then be used to create test programs automatically, and solutions for electrical testing and programming from the Embedded JTAG Solutions division will be presented live at the stand. The FlashFOX stand-alone programmer is a solution for embedded in-system programming (ISP) that reduces time and costs in the production process. It programs microcontrollers, flash components and PLD/FPGA on-board, i.e. in an already installed state. The range of embedded JTAG solutions is supplemented by the JTAG Unlimited Tester Juliet for electrical testing in the production environment. The desktop tester combines the entire system electronics and DUT adaptation via a removable cassette in one complete device.
dir/Gustl Keller
www.goepel.com
SMTconnect, Hall 4A, Stand 227
ISAT Institute for Sensor and Actuator Technology Coburg
The research institute for technological innovations ISAT offers sensor research for industrial applications, from sensor selection, sensor optimization and integration to the development of its own sensor solutions and presents its new optoacoustic measuring methods, radar measurements for spatially resolved humidity determination, magnetostrictive sensor technology and ultrasonic arrays.
dir/Kristina Altvater
www.isat-coburg.de
Sensor + Test, Hall 1, Stand 1-430
DPI Neptune with AI-supported inspection capability
Smartrep: KSMART solutions at the SMTconnect
At 'SMTconnect' in Nuremberg, SmartREP will be presenting products from the following groups: automated incoming goods inspection, laser marking, material disposition, solder pastes, systems for protective coating, depaneling, automation and handling equipment, automatic optical inspection (AOI) and X-ray inspection.
Solutions from Koh Young will also be exhibited. The focus will be on KSMART - a process optimization system that ensures quality and reliability standards in production lines. KSMART collects inspection and measurement data from all machines via its KSMART server to be used anywhere on the network via an intuitive user interface for defect detection, real-time optimization, improved decision making and traceability. With optimized parameters, deviations, false error messages and error slippage are avoided.
Kristina Altvater / Anna Neipp
www.smartrep.de
kohyoung.com/ge/ksmart-solutions
SMTconnect, Hall 4a Stand 225
Rogers FR4 Hybrid Multilayer PCB
LeitOn
LeitOn specializes in the development and production of printed circuit boards.
The team will be presenting its manufacturing technologies and solutions, such as the Rogers FR4 Hybrid Multilayer PCB.
dir/Kristina Altvater
www.leiton.de
PCIM Europe, Hall 5, Stand 214
Picture: LCP Laser-Cut-Processing GmbH
LCP Laser-Cut-Processing
The laser competence center for material processing LCP specializes in the laser processing of fine and micro-precision components and will be presenting its new USP laser technology. The use of ultrashort pulse lasers in USP laser processing of silicon wafers enables precise and fine processing and produces structures with high accuracy even on large surfaces. By dispensing with mechanical processing steps, the silicon wafer is not subjected to any mechanical stress and therefore avoids potential damage and cracks in the material.
dir/Kristina Altvater
www.lcpgmbh.de
Sensor + Test, Hall 1, Stand 1-54
Mersen Electrical Power
The company offers a product portfolio in the field of electrical protection and control and solutions for power management applications. For the development and supply of products for key markets such as commercial, industrial, renewable energy, power electronics and e-mobility, the company supports customers worldwide in design customization and optimization. Among other things, a new 500kVA 1.7kV SiC power stack will be presented. The latest SiC power stack reference design will also be presented. With capabilities up to 1200Vdc DC bus and up to 300Arms at 25kHz, the evaluation kit helps inverter designers save time and nerves when selecting individual components by benefiting from a solution that is pre-built for their specific application (e.g. DC smart grid, EV charging stations, renewables, e-mobility). In addition, Mersen's capacitor-to-busbar mounting technology offers DC link inductance as low as 7nH. DC high-voltage fuses for 1500V, 1000V and 500V platforms will also be presented. The focus is on fuses for energy storage systems, charging stations and electric vehicles. With ABAT and GBAT fuses for energy storage systems, D fuses for charging stations and MEV fuses for electric vehicles, a product portfolio has been developed that can withstand high alternating load cycles and low power losses. The new design of the Power Pack fuse will be presented during PCIM. The 'proof of concept' of the Power Pack fuse meets the latest MW charging requirements. Visitors can also find out about passive components such as cooling plates, capacitors and busbar solutions. Visitors to the stand can expect a presentation on EV battery protection and interconnection on June 11 and 12 from 12:30-12:50.
dir/Gustl Keller
www.ep.mersen.com
PCIM Europe, Hall 9, Stand 534
MEV Elektronik Service
MEV Elektronik Service, the distributor of electronic components, modules and systems, will be presenting CambridgeIC's resonant inductive position detection, among other products. The sensor technology measures the linear, rotational, curved or two-dimensional position of moving parts using sensors made from printed circuit boards. The flexible shapes and sizes make it easier to integrate the sensors into various products.
dir/Kristina Altvater
www.mev-elektronik.com
Sensor + Test, Hall 1, Stand 1-138
Microtech Gefell
Microtech Gefell (MTG) develops, manufactures and distributes microphone capsules, condenser microphones and acoustic systems for audio and measurement applications, such as capsules, preamplifiers, measurement microphones, power supplies, accessories, etc. The team will be presenting various new products, such as the M 380 measurement microphone. Based on microelectromechanical systems (MEMS), the microphones are manufactured using silicon technology on a printed circuit board, with dimensions in the millimeter range and lower production costs. Thanks to the MEMS capsule technology, they have a low tolerance of sensitivity and frequency response and are designed for acoustic measurements where multi-channel microphone arrangements are used or where interchangeability of microphones is an advantage.
dir/Kristina Altvater
www.microtechgefell.de
Sensor + Test, Hall 1, Stand 1-503
Mycronic: The MYPro A40 - agility accelerated
Flexibility Turbocharged: The MYPro MY300 sets the benchmark for productivity in high-mix PCB assembly. Its successor, the MYPro A40, now sets new standards with 48% faster placement speeds and the ability to place six times larger components with the MX7 high-speed placement head. This allows you to master any product mix and increase your production volume to an unprecedented level.
MYPro A40
As Mycronic customers grow, so do their requirements. Whether it's handling bulky, irregularly shaped components, preparing for series production or eliminating all possible machine calibration and maintenance, the obstacles often boil down to the age-old trade-off between speed and flexibility. With the new MYPro A40 pick and place machine, high flexibility and high-speed assembly can finally be combined.
48% higher throughput
The result is a significant increase in placement speed to 59,000 components per hour, compared to the maximum speed of 40,000 components per hour of its predecessor, the MYPro MY300.
Six times larger components
One sign of change is the growing variety of components housed in increasingly dense PCB designs. The new MX7 placement head meets these challenges with a customized design and an extended component range from 03015 up to 99 × 73 × 22 mm.
Completely new graphical user interface
Of course, any high-mix platform is only as efficient as its operator. For this reason, Mycronic has gone to great lengths to equip the MYPro A40 with a new graphical user interface (GUI). The new GUI is intuitive, powerful and provides straightforward step-by-step guidance on the touchscreen, while improving the display of key process data.
Text: Mycronic
www.mycronic.com
SMTconnect, Hall 4a, Stand 235
VT-X850
Omron
The latest inspection systems will be presented. Live demonstrations of fully integrated solutions will also be shown. In addition to traditional SMT lines, inspection solutions for the production of power modules and processes will be offered. The inspection systems use AI capabilities to improve accuracy, speed and efficiency. 'Dark factory' solutions are being developed for a more streamlined and automated manufacturing environment. Advanced technologies will be used to support manufacturers in reconciling man and machine. Among the products presented are the VP01G (3D-SPI), the VT-S1080 (3D-AOI) and the VT-X750 (High-Speed 3DCT AXI), all of which have functions for testing electronic assemblies and systems. One of the highlights is the new VT-X850 with innovative 3D CT technology.
dir/Gustl Keller
www.inspection.omron.de
SMTconnect, Hall 4A, Stand 305
Picture: onsemi
onsemi
In the automotive and industrial markets, onsemi is driving the transformation of trends such as electrification and safety in vehicles, sustainable energy supply networks, industrial automation as well as 5G and cloud infrastructure. The team introduces itself with its products in the field of power electronics and sensor technologies.
you/Kristina Altvater
www.onsemi.com
PCIM Europe, Hall 9, Stand 332
SMTconnect, Hall 4a, Stand 325
SCHUNK Electronic Solutions celebrates its 20th anniversary
For 20 years, SCHUNK Electronic Solutions has been impressing customers with high-tech stand-alone and inline solutions for high-precision manufacturing processes in the PCB and electronics industry. Depaneling machines from SCHUNK Electronic Solutions are high-performance process components for separating individual PCBs from electronic assemblies. They are separated using end mills, saws or laser heads. In addition to this variety of processes, the machines impress with a high degree of flexibility thanks to modular solutions and, thanks to the Dust Reduce Booster, also with a high degree of cleanliness.
To mark the 20th anniversary of SCHUNK Electronic Solutions, a special edition of 20 SAR-Compact stand-alone depaneling machines is now available. This solution is perfect for getting started with economical automated depaneling technology. In contrast to conventional separation methods, it offers flexibility, cleanliness, process reliability and a gentle separation process. It is characterized by a very good price-performance ratio: Despite low investment, the machine offers and fulfills all important functionalities and requirements of many key industries. This anniversary edition is equipped with a double shuttle system for short cycle times and has an effective milling area of 430x350 mm including extraction. Five tool changes per shuttle as well as tool breakage and diameter control are also included. The machine comes with ionization and ESD-compliant design with hand scanner. The special edition will go on sale at SMTconnect, the trade fair for electronics production in Nuremberg.
Text: SCHUNK Electonic Solutions
www.schunk.com
SMTconnect, Hall 4, Stand 205
SYSTECH Europe: Unbeatable precision - Flying Probe Test for the highest demands
Whether single-sided or double-sided, the TAKAYA APT-1600FD and APT-1400F test systems combine innovation with proven reliability. The APT-1400F is the single-sided system with a total of 4 + 2 flying needles, the double-sided APT-1600FD-A system has up to 6 + 4 flying needles. High-precision mechanics provide access to even the most complex assembly structures. For the current systems, the smallest contact points of 60 μm are sufficient for mains contacting. The electrical tests can be supplemented as required, for example with signature analyses, LED tests, optical tests and laser height measurements. The high test speed and greater test coverage significantly expand the range of applications. Thanks to the new PLUS Infinity software and state-of-the-art interface standards, the flying probers can be easily integrated into production processes. Plus Infinity therefore supports interfaces such as IPC SMEMA, IPC Hermes, IPC CFX and OPC UA. Not only is data exchanged with the MES systems, but the test processes can also be controlled by external specifications. The current workload is monitored, programs are loaded automatically and the test strategy for the flying prober can be adjusted quickly and easily using error statistics. TAKAYA's systems are characterized by simple program creation, excellent test coverage and outstanding reliability, making them the key to greater profitability and flexibility in electronics production.
At SMTconnect, the systems will be exhibited at the SYSTECH Europe stand.
SYSTECH Europe specializes in flexible testing of electronic assemblies and interconnection technologies in microelectronics.
Text: SYSTECH Europe
www.systech-europe.de
SMTconnect, Hall 4A, Stand 325
Zestron
The company will be providing information on the reliability of power and signal electronics, particularly in the high-voltage and e-mobility sectors, at its stand at 'PCIM' in order to do justice to the growing importance of this sector and the associated economic and technical challenges facing manufacturers. Electronics manufacturers receive comprehensive support in the production of reliable electronics: by installing a cleaning process or determining the failure risk of
assemblies in order to recommend specific remedial measures. At 'PCIM', engineers and technologists will provide advice on the topics of technical and ionic cleanliness, insulation coordination, moisture resistance and cleaning of power electronics.
dir/Gustl Keller
www.zestron.com
PCIM, Hall 6 Europe, Stand 242
