This fall, the European Institute for the PCB Community (EIPC) is offering three webinars on the global situation in the PCB industry. The main topics are automotive (October 14), telecommunications (November 18) and high-speed technology (December 16). The presentation part lasts around 45 minutes or 15 minutes per speaker. Afterwards, there will be time for questions and comments from participants. The webinars are free of charge for EIPC members; non-members will be charged a fee of €50.
The first session on October 14 on automotive technology and some of the key factors driving the global automotive PCB industry will focus on the entire PCB manufacturing supply chain: preparing for emerging changes in materials, processes, measurement systems, reliability and environmental impact. It will also look at what new technologies are available for PCB manufacturing that can support these future requirements. Speakers are Lenora Clark from ESI Automotive, Alun Morgan from Ventec and Paul Waldner from Multiline.
Lenora Clark will examine the impact of advanced packaging on the design and assembly of automotive electronic hardware. Her presentation will discuss and review all aspects of electronic assembly, starting with how increased power affects the semiconductor packages, how this then affects the design for PCB manufacture, and finally looking at the impact on materials for perfect assembly. Alun Morgan explores 'Reliability must be planned from the bottom up', reviews developments in electronics manufacturing to date and takes a comprehensive look at current and future requirements. Paul Waldner will present requirements for multilayer printed circuits for the automotive industry in the high-speed era. He will present new approaches to multilayer manufacturing processes.
