The 3D Electronics Innovation Network offers small and medium-sized enterprises (SMEs) the opportunity to become partners in the network and implement research projects on three-dimensional electronics. The participating companies receive support and expertise from industrial companies and research institutions in the network in order to advance their own innovation projects quickly and easily. Grants of up to €170,000 are available through the ZIM program of the Federal Ministry of Economics. The network initiated by the Fachverband Elektronik-Design (FED) is currently made up of 8 SMEs, 5 Fraunhofer Institutes, 2 universities and the network management facility Jöckel Innovation Consulting. Two further companies with a maximum of 500 employees can currently be included
The aim of the network is to develop innovative products and processes for individual and technically sophisticated electronic elements. Based on their expertise in six driving technology fields (3D CSP, embedded PCB, 3D printing, MID, flex/rigid-flex and hybrid), the partners form a committed and powerful consortium to take electronics to the next dimension. The focus here is on multifunctionality, performance, efficiency, minimal installation space and safety. The network complements and combines the expertise and know-how of industry and research. The network management team at Jöckel Innovation Consulting supports the network partners in applying for and processing funding projects.
When submitting a project, the content-related reference to the topic of 3D electronics can be interpreted very broadly. Applications for other funding programs are also possible. The participating SMEs also receive support from the network in the commercial exploitation of their developments. A joint public appearance under the '3D electronics' brand increases the visibility of the individual projects.
