The Japanese manufacturer Shibuya Kogyo Co. Ltd. has been active in mechanical engineering since 1931. Machines and products for the semiconductor market have been manufactured since 1976. In addition to laser markers and flip chip bonders, Shibuya has been focusing on systems for mounting solder balls on substrates and wafers since the 1990s. The SBP662 and SBM381 solder ball placer and inspection systems are among the technologically leading systems for solder ball mounting on wafers.
The SBP662 solder ball placement system impresses with its high positioning accuracy of less than 5 μm and the handling of solder balls with a size of up to 50 μm. A customized toolkit, adapted according to customer specifications and Shibuya design guidelines, ensures this high accuracy and enables a yield of 99.998% correctly placed solder balls.
The fully automated process - printing with flux, loading with solder balls and subsequent inspection of the wafers - results in a high throughput with very high repeatability. A throughput of up to 48 wafers per hour with a wafer size of 12", loaded with 60 μm solder balls and 1.5 million solder balls per wafer, demonstrates the high performance of the system.
Shibuya's non-contact 'ball cup' method enables solder ball deposition without contamination or deformation of the solder balls. The SBP662 system can be used for 6", 8" and 12" wafers. The 'Warpage Reformation & Wafer Thickness Measuring Function' developed by Shibuya enables compensation of deflections of up to 4 mm.
The SBM381 inspection unit is usually installed as an inline system together with the solder ball placement system. The SBM381 Repair & Inspection Unit is a system for inspecting and repairing any incorrectly positioned or missing solder balls. A high-speed camera and an innovative algorithm in the image processing enable a fast process: Fault detection, cleaning of the soldering surface, application of flux and placement of the solder ball. After the repair, a final check of the wafer is carried out before it is placed in a FOUP (Front Opening Universal Pod). nanotec international GmbH distributes Shibuya's products in Europe and also offers service and support.
