The Bodo Möller Chemie Group has now added thermally conductive solutions for electronics applications from Henkel's Bergquist brand to its range as part of its sales cooperation with Henkel. The thermal management materials include gap fillers and pads as well as thermally conductive adhesives and greases for electronics applications in the energy sector and industrial automation, consumer goods and industrial electronics as well as LED lighting technology (see also PLUS 11/2020 p. 1436 and PLUS 12/2020 p. 1574).
Bergquist products provide an effective thermal interface between electronic components and heat sinks where uneven surfaces and air gaps are present. The thermal interface films are permanently elastic and designed for long-term use. Liquid materials such as the Liquid Gap Filler offer the possibility of automated mixing and dosing for an exceptionally high production speed. By expanding its portfolio, Bodo Möller Chemie is further strengthening its international position as a distributor and application specialist in the market for adhesive solutions.
