Arrow Electronics and Bosch have signed a distribution agreement under which Arrow will now also distribute automotive semiconductor components on the European market. The two companies have previously cooperated in North America.
The distribution agreement means that Bosch's entire automotive semiconductor portfolio - from silicon carbide (SiC) power semiconductors and ASIC chips (application-specific integrated circuits) to MEMS sensors (microelectromechanical systems) - will be distributed in the European market. In future, the products will also be available directly via Arrow's online store.
Bosch is now distributing two generations of SiC chips via Arrow. The latest generation is characterized by optimized switching properties and a low on-resistance over the entire temperature range. All chips are available as unpackaged individual chips and also as packaged discrete chips for use in DC/DC converters, for example.
The ASIC components offered by Bosch are suitable for applications in engine and transmission control, for example, but also in steering and in driver assistance and safety systems. To match the SiC chips, there are innovative gate drivers that use intelligent control to increase efficiency and thus increase the range of electric vehicles.
MEMS sensors from Bosch are primarily used in modern vehicles for safety systems. Acceleration, angular rate and pressure sensors ensure, among other things, motion detection in adaptive chassis control and the timely deployment of airbags. A fully integrated Bluetooth low-energy sensor solution for tire pressure monitoring with extremely low power consumption is also available from Arrow. The portfolio also includes sensors for road noise canceling and condition monitoring of machines and systems.
