The films in the LIOTELAN family from Japanese manufacturer Toyochem are produced as insulating or conductive versions and are an alternative to metal shielding cups. With high water resistance, they have an elongation capacity of up to 500% and can be applied as a composite film, starting with an insulating layer followed by a highly conductive layer, to the EMI interferers mounted on the PCB substrate using a hot pressing process.
According to the manufacturer, they score points over conventional metal shielding cups thanks to their significantly more compact design and noticeably lower weight, without compromising on the shielding effect. Extra soldering processes are also eliminated. Circuit developers benefit from greater design freedom and, in particular, a very low profile, which enables more compact device designs. In addition, the composite film enables the production of particularly thin shielding laminates with high flexibility and conductivity or good insulation properties for high-tech PCB substrates.
Toyochem presented the new shielding films to the public for the first time in June 2023 at the International Microwave Symposium in San Diego, California.
