Inspection solutions for electronic assemblies in the smart factory

Inspection solutions for electronic assemblies in the smart factory

The systems from Göpel electronic for automatic optical inspection, X-ray and solder and sinter paste inspection (AOI-AXI-SPI) have now been added to the IPC CFX-2591 Qualified Products List.

The IPC CFX-2591 (CFX-Connected Factory Exchange) standard defines the requirements for the exchange of information between manufacturing processes and associated host systems for assembly production. The standard applies to communication between all executable processes in the manufacture of assembled printed circuit boards. It defines the communication protocol and content across all assembly processes. Systems that comply with the standard meet the basic requirements for Industry 4.0 and the smart digital factory for optimizing production processes.

With IPC-CFX, the electronic inspection solutions are now equipped with a standardized interface for recording all operating data. This means that the AOI, AXI and SPI systems can be integrated into manufacturing execution systems via the interface. The inspection systems are networked to check the solder paste, solder joints and component placement and communicate with other machines in the production line. This allows not only the quality of the electronic assemblies produced to be monitored, but also the manufacturing process.

  • Issue: Januar
  • Year: 2020
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Eugen G. Leuze Verlag GmbH & Co. KG
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88348 Bad Saulgau

Tel.: 07581 4801-0
Fax: 07581 4801-10
E-Mail: info@leuze-verlag.de

 

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