The management of Packaging Technologies (PacTech), a manufacturer of laser-based solder jetting and chip bonding systems as well as a wafer-level packaging service provider, has gained two new heads. CEO Thorsten Teutsch announced the internal promotions of Ms. Sy Jiun Sim and Mr. Matthias Fettke to Vice Presidents of the company in early March.
Ms. Sim began her career at PacTech in 2010 as Customer Support Manager at the Penang (Malaysia) site and subsequently moved to PacTech's headquarters in Germany in 2017 as Technical Marketing Manager. Ms. Sim will now lead the Wafer Level Packaging (WLP) business unit in Southeast Asia and Germany and oversee the expansion of WLP services.
Mr. Fettke, trained in laser and opto technology with a specialization in laser material processing, has been instrumental in the development of new laser bonding and soldering technologies at PacTech. His contributions led to numerous publications and patents. In his new role as Vice President Advanced Packaging Equipment, Mr. Fettke will lead this division to further advance PacTech's technological capabilities.
With its SB2 systems, PacTech offers flux-free and contactless soldering technology for the electrical contacting of camera modules, sensors, HDD and THT at its production sites in Germany, Malaysia and the USA. The Laplace machine platform enables automated laser bonding and reflow solutions along the heterogeneous integration roadmap for the packaging of thermally or geometrically demanding semiconductor chips, while the PacLine system enables fully automated processing of wafers up to 300 mm for the electroless deposition of Ni, Pd and Au. PacTech supplies various markets, including semiconductors, photonics, power electronics, 5G, microLED and MEMS.
