On September 16, 2020, the FED General Assembly elected Michael Schleicher (50) as a new member of the FED Board. Klaus Dingler and Rainer Taube were dismissed from the FED Board after many years of service. Both Klaus Dingler and Rainer Taube were among the first FED members. The Chairman of the Board, Prof. Rainer Thüringer, bid farewell to the two long-time supporters, who have always contributed ideas and energy to the FED, and thanked them for their extraordinary commitment.
Klaus DinglerMichaelSchleicher can contribute his many years of experience in the areas of layout, design, training and further education to the FED Board. He can draw on his work in national and international committees (FED, IEC, IPC and ZVEI). From today's perspective, one focus of his work remains networking, knowledge transfer and the further development of so-called "new technologies" with a focus on "high-power" and additive manufacturing methods.
Michael Schleicher began his training as an information electronics technician at Siemens in 1991 and took up his first position as a circuit board layouter at MEN micro elektronik nürnberg. In 1996, he graduated from the technical college for PCB technology in Schwäbisch Gmünd. He worked for the layout consulting firm GCD-Printlayout in Erlangen for various industries until 2008. Since 2008, Michael Schleicher has been working for Semikron Elektronik GmbH & Co KG as a layout designer in the development department.
As part of his layout work, Schleicher won the "Most Challenging High-Speed Design" award in 2001 for the layout of the Eurofighter's Enhanced SCAC. In 2012, he won the FED PCB Design Award in the "High-Power" category with a system for commercial vehicles developed at Semikron. He has been associated with the FED since 1993 through his first personal membership. Michael Schleicher has been a member of the FED Advisory Board responsible for norms and standards since 2017 and is actively involved in various FED committees. For the FED, he is actively involved in national and international standards in the field of assemblies in the committees DKE K 682, IEC TC 91 and various IPC committees. He has been a speaker at the FED seminar "High-Power Assembly Design" since 2019.
