The PCB manufacturer KSG has expanded its capacities in the field of organic surface coating and commissioned a new wet-chemical horizontal line in Gornsdorf, Saxony. The OSP line from TSK Schill enables the PCB manufacturer to implement a higher production volume and is characterized by optimized processing procedures and improved occupational safety.
As an alternative to metallic end surfaces, the organic tarnish protection OSP (Organic Solderability Preservative/Organic Surface Protection) is a cost-effective and RoHS-compliant variant that produces a flat soldering surface and can be renewed several times without damaging the PCB. The nickel-free coating is also suitable for high-frequency applications and can be combined with electroplated nickel-gold (NiAu) if required. This enables results to be achieved with a uniform layer thickness and a very homogeneous surface. The new OSP line is characterized by improved rinsing and drying technology as well as a constant etching rate of the pre-treatment through feed and bleed dosing of the pickle.
Occupational safety has also been improved: As the line has automatic chemical dosing and automatic pH monitoring and adjustment using a controller, less manual handling of chemicals by the line operator is required. Intuitive, clearly structured system software and a touch PC also simplify operation.
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