Emil Otto, a developer and manufacturer of fluxes for electronics production, strip tinning, radiator construction and galvanizing, is further expanding its metal chemistry product portfolio for soft soldering with new soldering and tinning pastes. The sustainable soldering and tinning pastes 'ZINNIN Green' do not require zinc chloride, are therefore not subject to labeling and can be used for soft soldering and tinning. They are particularly suitable for processing steel, brass and copper alloys. They can also be used in the electronics industry.
According to Markus Geßner, Marketing and Sales Manager at Emil Otto, soft soldering involves joining metals together using a solder at process temperatures below 450°C. In order for these joints to be as stable and durable as possible, the surfaces of the metals to be soldered must be as clean as possible and free of oxides. According to Gessner, the formation of oxides during the soldering process should also be avoided. To achieve this, Emil Otto has developed products such as flux concentrates, ready-to-use fluxes, soldering lotions, oils, pastes and greases.
The newly developed pastes are used in the metalworking industry as well as in electronics production and are also suitable for tinning printed circuit boards. They are available in three variants with different alloys: ZINNIN Green I with the alloy Sn100, ZINNIN Green II with the alloy Sn96.5 Ag3.0 Cu0.5 (SAC305) and ZINNIN Green III with the alloy Sn97Cu3.
Before use, the paste must be stirred until the green color of the usage indicator changes to metallic silver-grey. "This is absolutely essential to return the paste to a usable state," explains Gessner. "Stirring can be done with a stainless steel or wooden spatula." The paste is then applied to the parts to be treated using a brush or similar. In the case of overlapping parts or grooved pipe connections, the overlaps should also be lightly coated with the paste. "Due to the excellent activity of the flux contained, the pastes spread very well on the surfaces of the workpieces and penetrate perfectly into soldering gaps," says Gessner. If flux residues form after the soldering process, they can be removed with deionized water.