After a forced break of two years, there will be another SMTconnect in Nuremberg in 2022. The congress trade fair for solutions for electronic assemblies and systems will take place between May 10 and 12. Numerous previous participants from the electronics production industry have already confirmed their attendance, including Asys, Rehm and Viscom. The Test and Inspection exhibition area is fully covered.
One of the highlights of SMTconnect 2022 will once again be the 'Future Packaging' live production line organized by Fraunhofer IZM. Ulf Oestermann, Business Unit Developer at the Berlin-based Fraunhofer Institute for Reliability and Microintegration: "The aim of the production line is to shed light on the various aspects of the digitalized production of electronic assemblies." The aim is to clarify what expectations customers and clients have of a modern production line in the field of secure hardware production and the 'digital twin'. "How high must the degree of digitalization be in order to achieve the highest possible level of data robustness, while at the same time making optimum use of the potential for improvement that arises from the increasing use of self-optimizing machines?"