Proemion, a manufacturer of telematics modules for fleet management systems, uses a new solder paste inspection system from Koh Young to optimize the printing process for solder pastes. The 3D measurement data from the SPI system was used to fine-tune the stencil tension, squeegee direction and print offset, among other things.
Previously, the company used optical inspection to check the solder paste after printing. Because connectors, BGAs, ICs and OSCs are installed in the telematics modules, the new SPI system is an important addition to the automatic optical inspection, because after assembly and soldering, the AOI can only check whether the BGA has been placed correctly and is not tilted. The new SPI system is used to monitor the printing process and tombstone effects can be reduced. A print of the solder paste that is not visible to the naked eye leads to the well-known tombstone effects, especially with 0201 components. Here, the SPI not only helps to detect errors, but also to regulate the process precisely by readjusting the pressure. With the help of the SPI, it was recognized that the squeegee direction during printing has an influence on the result. The SPI is also used to check form errors and thus draw conclusions about the stencils with regard to the stencil frame and clamping force. The new SPI has proven to have a very low pseudo error rate and no slippage. Distributor SmartRep sells Koh Young systems in Germany and also takes care of installation, service and support.
www.proemion.com
www.smartrep.de
www.kohyoung.com
