The Motek/Bondexpo trade fair is in full preparation for October 5 to 8, 2021 in Stuttgart. Exhibitors and trade visitors can look forward to the traditional trade fair duo as the most important trade fair for the industrial automation sector this fall.
For the 39th Motek - International Trade Fair for Production and Assembly Automation - and the 14th Bondexpo - International Trade Fair for Bonding Technology - the trade fair organizer, P.E. SCHALL GmbH & Co. KG, reports a "very pleasing" booking status: "We can clearly feel how much our exhibitors are looking forward to real technical discussions with customers and interested trade visitors," says Managing Director Bettina Schall.
Automation intelligence for production and assembly - put into practice
The industrial manufacturing sector is currently putting networking, digitalization and automation into practice. The smart factory is a reality. "The remarkable technological developments that we have seen in recent years are now coming together 'on the road'," states Motek Project Manager Rainer Bachert. Robotics, sensor technology, image processing, handling and transportation are increasingly autonomous, fully integrated solutions in the context of production and assembly automation. The role of software is becoming increasingly important, and AI solutions are also gradually and naturally finding their way into industrial production processes. "Robots have long since ceased to stand alone," says Rainer Bachert. "We will therefore see many interesting complete robotics solutions at the trade fair, including for new markets."
Integrated solutions, complementary topics: optimal interaction between all participants
Companies and businesses have noticeably stepped up automation and digitalization, and production processes and industrial material flows have been improved and adapted. With the optimal interaction of overall systems, production companies are entering new dimensions in terms of efficiency, sustainability, safety and supply chain reliability. The traditional and proven double trade fair Motek/Bondexpo is also about optimal complementarity in terms of theme structure: the complementary Bondexpo focuses on industrial joining and bonding technology. It can be used to join almost any combination of materials, whether they are identical or different, without losing the material properties and the associated advantages.
Joining and bonding technology - a topic for the future
Many technological developments are only possible through the use of state-of-the-art adhesives, for example in energy-saving lightweight constructions in the transportation sector, in electric cars and in wind power or photovoltaic systems. "The use of adhesives has become indispensable in many industrial and trade sectors and will become even more important in the future," explains Dr. Vera Haye, Managing Director of the Industrieverband Klebstoffe e.V. (IVK). Bonded products can improve both energy efficiency and material efficiency compared to alternative products. Bonding is the only joining technology that allows different high-tech materials to be joined in a material-compatible manner while retaining their advantageous properties.
Motek/Bondexpo: the perfect setting for B2B communication
As the leading trade fair for the world of automation, Motek/Bondexpo presents an up-to-the-minute portfolio of products and services - components, assemblies, subsystems, software and complete systems. The trade fair organizer has adapted and expanded the nomenclature and product classification in the "Software for assembly" section. Exhibitors from the software sector will be presenting their solutions in Hall 1. The trade fair date of October 5 to 8, 2021 should definitely be noted for the personal meeting of the excellent business community in Stuttgart.
