In order to detect hidden solder joints and critical voids in surface solder joints, a 3D AXI system with particularly sharp layer images is required. Modern 3D X-ray technology with integrated planar computed tomography (CT) makes this possible.
The precise and fast inline inspection of large flat assemblies in 3D is the core function of the new compact 3D AXI system iX7059 PCB Inspection XL from Viscom. The modern 3D X-ray technology of the Evolution 5 image acquisition concept with integrated planar computed tomography (CT), together with a new handling concept, delivers the best inspection results with the highest cycle time requirements. The system provides the extremely high inspection accuracy required for densely populated and very complex boards.
The system is intended for production lines that process printed circuit boards, LEDs and power semiconductors for e-mobility or high/direct voltage transmission and require 100% quality control. For the zero-defect strategy, the 3D inline X-ray inspection of the iX7059 generation ensures seamless, high-precision defect detection at maximum throughput. At the heart of the system is a powerful microfocus X-ray tube. It inspects thick, very dense and double-sided assemblies comprehensively in inline mode with high transmission. This also reliably detects concealed solder joints with strong shadowing. Intelligent void measurement with regard to number, size and proportionate area as well as a complete solder joint inspection of wired components and multi-layer boards is also ensured. This is important for hybrid power modules, chip layers and substrate layers. The closed 130 kV tube (optionally also 160 kV) operates maintenance-free. The inspection scope covers intelligent void measurement in terms of number, size and proportionate area as well as a complete solder joint inspection of wired components and multi-layer boards. This is important for hybrid power modules, chip layers and substrate layers.
With the Heavy Flex handling options, very heavy objects can be inspected inline using 3D AOI and 3D AXI
With the Heavy Flex handling options, very heavy objects can be inspected inline using 3D AOI and 3D AXI
The flexible X-ray system enables precise inspection strategies in 2D, 2.5D and 3D with a resolution of 8.5 to 25 µm. Evolution 5 with the new T3 flat panel detector generation is used for high-precision and very fast 3D X-ray inspection. The 3D images - up to 120 images in around 5 seconds for a field of view - are taken from a wide variety of views and with oblique transmission in motion. This further optimizes the inspection time. In combination with the powerful planar computed tomography, all significant features are visible in layered images with a high level of detail
Heavy Duty Inspection with special transport for workpiece carriers and solder frames. This simplifies verification, reduces false alarms, saves time-consuming rework and avoids costly product rejects.
The inline system with its new handling concept transports and detects PCBs - also on workpiece carriers - up to 15 kg and a size of 660 x 1000 mm (optionally up to 1600 mm in length) with its extended longboard option. The compact system design with dimensions of 1493 x 1654 x 2207 mm (W x H x D) allows inline or island installation with the smallest footprint.
Other highlights include automatic grey scale calibration, a barcode scanner (optional), M2M networking via Viscom Quality Uplink and an MES interface tailored to customer requirements for complete traceability. Convenient system operation via the touchscreen monitor and the simple, fast creation of inspection programs with the vVision or EasyPro operating software round off the system concept.
Heavy Duty Inspection
Many modules and options make it possible to configure task-adapted AXI systems: The iX7059 Heavy Duty Inspection X-ray system is a member of the new Viscom iX series for fast, fully automatic inline X-ray inspections. A special transport system for handling workpiece carriers or solder frames was developed for the cycle time-accurate transport of heavy and housed assemblies. It can transport assemblies measuring up to 500 x 500 mm and weighing up to 40 kg. This means that automatic X-ray inspection is also finding its way into electromobility, network infrastructure for 5G and renewable energies.
3D AXI system for high-precision void measurement of surface soldering and THT solder jointsE-mobilityin particular is leading to heavier and larger electronic assemblies. Viscom has developed a new handling system for assemblies weighing up to 15 kg for such inspection objects, e.g. power electronics. With project-specific adaptations, significantly heavier objects weighing up to 40 kg can also be inspected in inline mode.
Electronic assemblies for electric drives or motor control units or in telecommunications, medical and industrial technology are often very complex and fitted with large components and connectors. Or they are already fully assembled before the solder joint inspection. Viscom has developed the Heavy Flex handling solution for large and heavy objects that need to be inspected fully automatically in the process line. The Heavy Flex options are available for the Viscom S3016 ultra systems for optical 3D inline inspection from below, for the 3D AOI systems of the S3088 series and for the iX7059 3D X-ray systems.
With Heavy Flex, PCBs weighing up to 15 kg and measuring up to 450 x 400 mm can be inspected inline using both automatic optical inspection (3D AOI) and automatic X-ray inspection (3D AXI). As an option, assemblies on workpiece carriers or test objects weighing up to 40 kg can be integrated and inspected automatically. The control components and the dimensions of the inspection system remain unchanged. Thanks to the new handling concept, even very heavy test objects can be transported at a speed of 600 mm/s.
With the modular system design, a specific overall solution can also be developed if the customer's existing transport system of the process line is also to be integrated into the optical or X-ray inline inspection. For a seamless connection, Heavy Flex can integrate commercially available transport systems for the fully automated transport of assemblies on workpiece carriers. The connection is made via familiar standard interfaces. At the start of the project, up to 70% of the effort required to adapt to customer-specific requirements is already covered for individual transport integration. Further assembly-specific changes and process integration at the customer usually only require a few more days.
