With its new VT-S10 series PCB inspection system, Omron is introducing new imaging technology combined with AI functions to automate the high-precision inspection of PCB sub-assemblies. The basic idea is to ensure the inspection processes without specialized knowledge on the part of the operating personnel. VT-S10 is aimed at the production of high-density and compact board systems, for example for 5G equipment and autonomous electric vehicles, with a view to quality, safety and security, where conventional PCB inspection reaches its limits in the detection of problematic solder topographies.
VT-S10 is equipped with Omron's proprietary MDMC (Multi-Direction Multi-Color) imaging technology. It flexibly and automatically optimizes the illumination angle, light intensity and coloring according to the shape of the components and solder joints on the board. It thus eliminates the disruptive influence of shadows caused by neighboring tall components. Omron explains that the VT-S10 can reduce inspection time by up to 70%. The use of AI also makes it possible to automate inspection processes that were previously dependent on the expertise of trained operators.
Omron's Q-upNavi Analysis software also improves the quality of monitoring, resulting in fewer defects. VT-S10 creates a database of inspection results for each process used, including numerical values and images. By automatically optimizing the post-print/post-placement inspection criteria based on the final process, VT-S10 increases the first-pass yield. Networking with production equipment from other manufacturers is possible.
